System-in-Package industry will reach more than $19B by 2026

System-in-Package Technology and Market Trends 2021 report from Yole Développement (Yole) say that the SiP market is expected to increase from US$14 billion in 2020 to US$19 billion+ in 2026. The SiP product line includes high- to mid-end SiP devices, such as computing and data center applications, with much higher margins than the low-end SiP devices found in mobile handsets. High-end SiP market segment is expected to grow at a 9% CAGR between 2020 and 2026, whereas the low-end RF SiP one, found in mobile phones, is expected to grow at a slightly lower CAGR of 5% from 2020 to 2026.

In this dynamic context, Yole and System Plus Consulting, both part of Yole Group of Companies, investigate disruptive semiconductor technologies and related markets in depth.

“SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the Semiconductor, Memory & Computing division at Yole Développement (Yole).

He adds: “The SiP platform is crucial inachieving ‘More than Moore’ in the race for heterogeneous integration, where advanced packaging remains at the forefront with front-end technology.”

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