NewsMarket / Trends
-
Halo Microelectronics agrees to sell Its AC-DC silicon controller IC ventureHalo Microelectronics announced an agreement to sell the remaining interest in its AC-DC silicon...
-
Pickering Interfaces announces 3-pronged approach to obsolescence avoidancePickering Interfaces announced the company’s formal approach to protecting customers from one of the...
-
Semtech Corporation completes acquisition of Sierra WirelessSemtech Corporation and Sierra Wireless announced the completion of Semtech’s acquisition of Sierra Wireless...
-
Omdia: 69% shipment share in 2022 for chinese panel makers in industrial and public display marketBased on Omdia‘s Industrial and Public Display & OEM Intelligence Service, the industrial and...
-
Infineon cooperate with Fingerprints Cards for biometric payment cardsInfineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialization...
-
Bel appoints Global ESG DirectorBel Fuse announced the appointment of Ping Gencianeo as its new Global ESG Director....
-
Infineon Austria cooperates with University of ZagrebInfineon Austria and the Faculty of Electrical Engineering and Computing (FER) at the University...
-
CEVA celebrates 15 billionth CEVA-powered chip shippedCEVA announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion...
-
FBDi association: strong second quarter for the German components distributionA brilliant second quarter of 2022 continues to let the German component distribution dream...
-
EBV Elektronik awarded 2021 Best Performing Distributor in EMEA by STMicroelectronicsEBV Elektronik has been recognised by STMicroelectronics as the “2021 Best Performing Distributor in...
-
IC Insights: O-S-D bulletinWorldwide sales of optoelectronics, sensors and actuators, and discrete semiconductors (O-S-D) each climbed to...
-
AMD completes acquisition of XilinxAMD announced that it has completed the acquisition of Xilinx, creating the high-performance and...
-
System-in-Package industry will reach more than $19B by 2026System-in-Package Technology and Market Trends 2021 report from Yole Développement (Yole) say that the...
-
Dialog Semiconductor extends partnership with SiFiveDialog Semiconductor announced that it has extended its partnership with SiFive. Dialog is SiFive’s...
-
Zigbee Alliance change its name to Connectivity Standards AllianceThe Zigbee Alliance announced its organizational rebrand to the Connectivity Standards Alliance (CSA). The...
News/Analysis read all ▶
-
KYOCERA AVX launches new solderless WTB card-edge connectorsKYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
-
Renesas completes acquisition of TransphormRenesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
-
Linxens and Nocturnal join forces to accelerate the development of innovative medical devicesLinxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
Products read all ▶
-
Advantech launches ITA-168/178 seriesAdvantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
-
Solid Sands launches SuperGuard Amsterdam version 1.2Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
-
A new add-on board for global tracking and telematics from MIKROEMIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
