NEWS / ANALYSIS
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MikroE: starter board accelerates design
MikroElektronika (MIKROE) unveiled CLICKER 4 the first in the series of MIKROE starter boards...
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Nanusens recruits Dr. Phil Daniell as VP of ASIC Engineering
Nanusens has appointed Dr. Phil Daniell as its VP of ASIC Engineering. He has...
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Keysight introduces optimized in-line high density in-circuit test system for PCBA
Keysight Technologies introduces the new Keysight i3070 Series 7i in-line test system, an automated...
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Nexperia and Mitsubishi Electric agree on strategic partnership for discrete SiC MOSFETs
Nexperia announced that it has entered into a strategic partnership with Mitsubishi Electric Corporation...
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New 21-slot fully hybrid PXIe chassis & PXIe embedded controller from Pickering Interfaces at productronica
Pickering Interfaces will launch two new products designed to enhance testing capabilities – a...
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SureCore and Intrinsic announce collaboration for ReRAM technology
SureCore and Intrinsic have announced a collaborative relationship to accelerate time to market for...
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ROHM completes acquisition of new production site
ROHM has completed the acquisition of the assets of Solar Frontier’s former Kunitomi Plant...
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Rutronik founds new division with Rutronik IT Electronics
With Rutronik IT Electronics, the broadline distributor for electronic components Rutronik establishes a new...
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Cadence expands Pfizer’s license to molecular design software
Cadence Molecular Sciences (OpenEye)—a business unit of Cadence—announced that Pfizer Inc. has signed an...
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Socionext announces collaboration with Arm and TSMC
Socionext announced a collaboration with Arm and TSMC for the development of an innovative...
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TDK and LEM set to collaborate on next-generation TMR-based ICS
TDK Corporation and LEM International SA announce that they have entered into a development...
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Elke Reichart takes over responsibility for Digital Transformation on the Infineon Management Board
The Infineon Technologies AG Supervisory Board has appointed Elke Reichart to the Management Board...
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Hyundai Motor Company, Kia Corporation and Infineon sign multi-year supply agreement for power semiconductors
Infineon Technologies, Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement...
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4JM Solutions expands relationship with Advantest
Semiconductor equipment service provider 4JM Solutions announced it has expanded its sales and service...
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SECO at SPS 2023: scalable Modular Vision HMI family for cross-industry applications
SECO will debut its HMI family, Modular Vision, in various sizes to the public...
Products read all ▶
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Bel expands series of three phase dry type transformers
Bel Fuse announced that its Signal Transformer division released the expansion to their 3PH...
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MikroE: starter board accelerates design
MikroElektronika (MIKROE) unveiled CLICKER 4 the first in the series of MIKROE starter boards...
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Ultra expandable 3.5″ board with four display connectors from ICP
With the Wafer-ADL-P ICP Germany complements its portfolio in the area of embedded boards....