Tag per "agreement"
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Infineon expands supplier base for silicon carbide wafers
Infineon Technologies and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide...
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Politecnico di Milano and NHOA Group to strengthen their partnership
NHOA Group (NHOA.PA, formerly Engie EPS) and Politecnico di Milano announced the signing of...
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ABB’s technical expertise for Savannah Resources
ABB and Savannah Resources plc have signed a Memorandum of Understanding (MoU) to explore...
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MicroSys cooperates with EBV Elektronik in EMEA
MicroSys Electronics announced that it has signed an agreement with EBV Elektronik that will...
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Renesas Acquires Celeno to expand connectivity portfolio
Renesas Electronics Corporation announced it has entered into a definitive agreement with Celeno Communications,...
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Munters signs strategic project for a lithium battery laboratory
Munters has signed a strategic turnkey project to design and build a lithium battery...
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Infineon and Panasonic accelerate GaN technology development
Infineon Technologies and Panasonic Corporation have signed an agreement for the joint development and...
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Northforge Innovations signs agreement for EMEA and North America
Northforge Innovations announced that it has signed an agreement with Avnet and EBV Elektronik,...
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Melexis announces an exclusive license agreement with Chronoptics
Melexis has entered into a license agreement with Chronoptics, a specialist in the design...
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Powell Electronics signs European deal with P & P Technology
Powell Electronics has signed a pan-european franchise distribution agreement with P & P Technology,...
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SECO signs new agreement with French ChipSelect
To further develop its potential in this area, and in line with its strategy...
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AMS Technologies broadens portfolio with pulsed fibre laser systems
AMS Technologies has added Swiss supplier Onefive’s ultrashort-pulse fibre lasers to its portfolio. Based...
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GaN Systems: accordo di distribuzione con Ecomal Europe
GaN Systems ha siglato un accordo di distribuzione con Ecomal Europe per la promozione...
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Nec and Renesas: «The merger will bring to market better embedded products»
Interview with Rob Green, President & Ceo of Renesas Electronics...
News/Analysis Tutti ▶
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Le previsioni di TrendForce per le memorie
Gli analisti di TrendForce indicano che l’attuale tensione nell’approvvigionamento delle memorie diminuirà nella seconda...
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Certificazione di sicurezza per i computer Moxa
I computer Moxa della serie UC basati su architettura Arm a 64 bit che...
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
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Amphenol: nuovi connettori compatti
Amphenol Industrial Operations ha introdotto nella sua offerta di connettori la nuova serie ePower-Lite...
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...













