Tag per "agreement"
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Nordic and Sisvel to streamline cellular IoT SEP licensingNordic Semiconductor announces new agreement between Nordic and patent pool administrator, Sisvel, for the...
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TDK and LEM set to collaborate on next-generation TMR-based ICSTDK Corporation and LEM International SA announce that they have entered into a development...
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Hyundai Motor Company, Kia Corporation and Infineon sign multi-year supply agreement for power semiconductorsInfineon Technologies, Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement...
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4JM Solutions expands relationship with AdvantestSemiconductor equipment service provider 4JM Solutions announced it has expanded its sales and service...
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Infineon and Semikron Danfoss sign supply agreement for electromobility chipsInfineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply...
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ROHM will acquire new production siteROHM has reached a basic agreement with Solar Frontier K.K. to acquire the assets...
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Renesas and Wolfspeed sign 10 year Silicon Carbide wafer supply agreementRenesas Electronics Corporation and Wolfspeed announced the execution of a wafer supply agreement and...
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Intel Foundry and Arm announce multigeneration collaborationIntel Foundry Services (IFS) and Arm announced a multigeneration agreement to enable chip designers...
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Ultra-low-power bi-directional wireless mesh network modules from NeoCortec now available at TMENeoCortec has recently signed a new global distribution agreement with Poland based distributor TME...
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Renesas to acquire Panthronics to extend connectivity portfolio with NFC technologyRenesas Electronics announced its wholly owned subsidiary has entered into a definitive agreement with...
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Halo Microelectronics agrees to sell Its AC-DC silicon controller IC ventureHalo Microelectronics announced an agreement to sell the remaining interest in its AC-DC silicon...
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ROHM and BASiC Semiconductor form a strategic partnershipShenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC...
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Infineon cooperate with Fingerprints Cards for biometric payment cardsInfineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialization...
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ROHM, Mazda and Imasen sign a joint agreementROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen...
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Nicomatic announces global distribution partnership with PEI-GenesisNicomatic announces a global distribution agreement with PEI-Genesis, headquartered in Philadelphia, Pennsylvania. The partnership...
News/Analysis Tutti ▶
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Siemens acquisisce Precision InnovationsSiemens ha siglato un accordo per l’acquisizione di Precision Innovations, azienda specializzata in software...
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Accordo strategico tra Molex e PrysmianMolex ha siglato un accordo di fornitura a lungo termine con Prysmian, azienda focalizzata...
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Maturità per la tecnologia High NA Euv di AsmlLa tecnologia High NA Euv di Asml ha raggiunto la fase di maturità consentendo...
Products Tutti ▶
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Melexis presenta un nuovo driver per ventoleMelexis ha ampliato la famiglia di driver per ventole di raffreddamento MLX90412 con un...
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Driver radiation-hardened da InfineonRIC70115 è un driver per Hemt (High-Electron Mobility Transistor) di Infineon. Peculiarità di questo...
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Emerson presenta una nuova architettura di testEmerson ha sviluppato una nuova architettura di test modulare utilizzabile per i veicoli software-defined....
