NEWS / ANALYSIS
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Intel Launches Agilex 7 FPGAs with R-Tile
Intel‘s Programmable Solutions Group launched the Intel Agilex 7 with the R-Tile chiplet. It...
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Inova Semiconductors achieves a hat-trick: F.A.Z.-Institut honours the company as an innovation leader in Germany for the third year in a row
The F.A.Z.-Institut – a subsidiary of the Frankfurter Allgemeine Zeitung – ranks Inova Semiconductors...
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Renesas expands focus on India with new NB-IoT solution
Renesas Electronics introduced an NB-IoT (Narrowband Internet of Things) chipset specifically for the Indian...
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Danisense to exhibit at PCIM 2023
Danisense will be exhibiting at PCIM 2023 in Nuremberg from 9th to 11th May...
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Infineon enables innovative solution for second life of electric passenger car batteries
STABL Energy uses MOSFETs from Infineon Technologies to make stationary energy storage systems from...
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Partnership between Parasoft and TASKING
Parasoft has announced a partnership with TASKING. The partnership offers an integrated software development...
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SatixFy Communications and Presto Engineering announce partnership
SatixFy Communications announced a strategic partnership with Presto Engineering. This partnership supports SatixFy’s growth...
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Intel Foundry and Arm announce multigeneration collaboration
Intel Foundry Services (IFS) and Arm announced a multigeneration agreement to enable chip designers...
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Pre-Switch, appoints ex-Audi inverter designer as new CTO
Pre-Switch has appointed Jacek Borecki as Chief Technology Officer. Previously, Borecki was the senior...
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ROHM presents high-performance solutions
At PCIM Europe ROHM Semiconductor will showcase its new power semiconductors, including high-performance solutions...
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Sondrel signs EDA license extension with Siemens for three more years
Sondrel has secured the continuity of its use of Siemens EDA software with a...
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GlobalData: GPT-4 ignites race for artificial general intelligence
The recent launch of GPT-4 by OpenAI is likely to open the chase for...
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KYOCERA AVX antenna simulation models available in Ansys HFSS 3D electromagnetic simulation software
KYOCERA AVX announced that direct links to simulation models for its embedded antennas are...
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SECORA Pay portfolio available in 28 nm chip technology
Infineon Technologies expands its SECORA Pay solutions portfolio to 28 nm technology. With this,...
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Ultra-low-power bi-directional wireless mesh network modules from NeoCortec now available at TME
NeoCortec has recently signed a new global distribution agreement with Poland based distributor TME...
News/Analysis Tutti ▶
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
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NXP integra radio e audio per l’automotive
SAF9800 è un nuovo processore audio e radio di NXP destinato al settore automotive....
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Partnership tra Intel e Fortinet per SP6
Intel e Fortinet hanno annunciato una collaborazione strategica finalizzata allo sviluppo del Fortinet Security...
Products Tutti ▶
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...
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Il nuovo power analyzer di Yokogawa
Il nuovo analizzatore di potenza ad alta precisione WT1500 di Yokogawa Test & Measurement...

