NEWS / ANALYSIS
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NVIDIA, ServiceNow and Accenture Team to speed genAI adoption
NVIDIA, ServiceNow and Accenture announced the launch of AI Lighthouse, a first-of-its-kind program designed...
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ROHM receives Bosch Global Supplier Award 2023
ROHM ranks globally among the best suppliers of Bosch, the supplier of technology and...
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Infineon and Semikron Danfoss sign supply agreement for electromobility chips
Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply...
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TE Connectivity drives adoption of Single Pair Ethernet standard with SPE Industrial Partner Network
TE Connectivity has been a driving force behind the new IEC 63171-7 international electrotechnical...
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ROHM will acquire new production site
ROHM has reached a basic agreement with Solar Frontier K.K. to acquire the assets...
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DATA MODUL: successful participation in the innovation competition
Ranga Yogeshwar congratulates DATA MODUL from Munich on being awarded the TOP 100 Seal....
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Renesas and Wolfspeed sign 10 year Silicon Carbide wafer supply agreement
Renesas Electronics Corporation and Wolfspeed announced the execution of a wafer supply agreement and...
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Infineon and Kontrol join forces to improve the safety of autonomous vehicles
Infineon Technologies and the Austrian product compliance company Kontrol are entering into a strategic...
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OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification services
Siemens Digital Industries Software announces that OKI IDS has adopted Siemens Catapult software for...
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RS Components and CUI Devices enter into distribution agreement
CUI Devices announced that it has signed a distribution agreement with RS Components. As...
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German government agree on increased scope for Intel wafer fabrication site in Magdeburg
Intel and the German federal government have signed a revised letter of intent for...
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Vitesco Technologies and ROHM have signed a long-term SiC supply partnership
Vitesco Technologies has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through...
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IAR and Heroic Faith Medical to enhance data security for the healthcare
IAR joins forces with Heroic Faith Medical to enhance data security in the healthcare...
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Intel plans assembly and test facility in Poland
Intel announced that it has selected an area near Wrocław, Poland, as the site...
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Powercast and Powermat partnership
Two of the world’s pioneers of wireless power technology, Powercast with its long-range over-the-air...
News/Analysis Tutti ▶
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
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NXP integra radio e audio per l’automotive
SAF9800 è un nuovo processore audio e radio di NXP destinato al settore automotive....
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Partnership tra Intel e Fortinet per SP6
Intel e Fortinet hanno annunciato una collaborazione strategica finalizzata allo sviluppo del Fortinet Security...
Products Tutti ▶
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...
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Il nuovo power analyzer di Yokogawa
Il nuovo analizzatore di potenza ad alta precisione WT1500 di Yokogawa Test & Measurement...

