NEWS / ANALYSIS
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Nexperia announces 2023 financial results
Nexperia announced its financial results for 2023, including strong growth in its key market...
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Infineon supplies SiC power modules to Xiaomi EV
Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and...
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Siemens collaborates with TSMC on design tool certifications
At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that...
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Infineon and ETAS collaborate to optimize security of next-generation AURIX MCU
Infineon Technologies has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the...
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KDPOF collaborates with Hinge Technology
KDPOF announced their strategic partnership with Hinge Technology to solve key technical issues in...
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Intel welcomes Open Platform for enterprise AI
The Linux Foundation AI & Data announced the Open Platform for Enterprise AI (OPEA)...
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Infineon provides FOXESS with power semiconductors
Infineon Technologies supplies its power semiconductor devices to FOXESS, a fast-growing company in the...
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Anglia Live expands footprint into Europe
Anglia Components PLC recently announced it is bringing the Anglia Live eCommerce platform to...
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Renesas expand its power semiconductor production capacity
Renesas Electronics announced that it has started operations at its Kofu Factory, located in...
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VIA optronics and Antolin unveil Sunrise
VIA optronics and Grupo Antolin–Irausa, a global provider of automotive technology solutions, recently unveiled...
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Advantest and Toray Engineering establish technical partnership
Advantest Corporation announced that it has entered into a technical partnership with Toray Engineering...
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Infineon and Amkor deepen partnership
Infineon Technologies is strengthening its outsourced backend manufacturing footprint in Europe and announced a...
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Nordic Semiconductor showcases Thingy:91 X
At embedded world Nordic Semiconductor will share a preview of its breakthrough “Thingy:91 X”,...
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Green Hills Software delivers new solutions for NXP’s Open S32 CoreRide platform
Green Hills Software announced its significant role in NXP Semiconductors’ open S32 CoreRide platform,...
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SECO and NXP collaborate to bring Clea to industrial and IoT applications
SECO announced it is working with NXP Semiconductors to bring SECO’s Clea software solution...
News/Analysis Tutti ▶
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Sempre più Intelligenza Artificiale per Emerson
Emerson ha introdotto nuovi miglioramenti a NI Nigel AI, estendendone le funzionalità all’intero portafoglio...
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Partnership tra TDK e LG Innotek
TDK e LG Innotek hanno annunciato di aver siglato una partnership strategica per l’Intelligenza...
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Le previsioni di TrendForce per le memorie
Gli analisti di TrendForce indicano che l’attuale tensione nell’approvvigionamento delle memorie diminuirà nella seconda...
Products Tutti ▶
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I nuovi isolatori a stato solido di Infineon
Infineon ha introdotto una nuova tecnologia per gli isolatori a stato solido (SSI) che...
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Amphenol: nuovi connettori compatti
Amphenol Industrial Operations ha introdotto nella sua offerta di connettori la nuova serie ePower-Lite...
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...

