NEWS / ANALYSIS
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Nexperia announces 2023 financial results
Nexperia announced its financial results for 2023, including strong growth in its key market...
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Infineon supplies SiC power modules to Xiaomi EV
Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and...
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Siemens collaborates with TSMC on design tool certifications
At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that...
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Infineon and ETAS collaborate to optimize security of next-generation AURIX MCU
Infineon Technologies has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the...
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KDPOF collaborates with Hinge Technology
KDPOF announced their strategic partnership with Hinge Technology to solve key technical issues in...
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Intel welcomes Open Platform for enterprise AI
The Linux Foundation AI & Data announced the Open Platform for Enterprise AI (OPEA)...
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Infineon provides FOXESS with power semiconductors
Infineon Technologies supplies its power semiconductor devices to FOXESS, a fast-growing company in the...
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Anglia Live expands footprint into Europe
Anglia Components PLC recently announced it is bringing the Anglia Live eCommerce platform to...
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Renesas expand its power semiconductor production capacity
Renesas Electronics announced that it has started operations at its Kofu Factory, located in...
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VIA optronics and Antolin unveil Sunrise
VIA optronics and Grupo Antolin–Irausa, a global provider of automotive technology solutions, recently unveiled...
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Advantest and Toray Engineering establish technical partnership
Advantest Corporation announced that it has entered into a technical partnership with Toray Engineering...
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Infineon and Amkor deepen partnership
Infineon Technologies is strengthening its outsourced backend manufacturing footprint in Europe and announced a...
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Nordic Semiconductor showcases Thingy:91 X
At embedded world Nordic Semiconductor will share a preview of its breakthrough “Thingy:91 X”,...
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Green Hills Software delivers new solutions for NXP’s Open S32 CoreRide platform
Green Hills Software announced its significant role in NXP Semiconductors’ open S32 CoreRide platform,...
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SECO and NXP collaborate to bring Clea to industrial and IoT applications
SECO announced it is working with NXP Semiconductors to bring SECO’s Clea software solution...
News/Analysis Tutti ▶
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Partnership tra Intel e Fortinet per SP6
Intel e Fortinet hanno annunciato una collaborazione strategica finalizzata allo sviluppo del Fortinet Security...
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Nuova collaborazione tra Farnell e Hailo
Farnell ha annunciato di aver stretto una nuova partnership a livello globale con Hailo,...
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Consystem rinnova il sito web
Consystem rinnova la propria presenza digitale con un nuovo sito progettato per offrire una...
Products Tutti ▶
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...
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Il nuovo power analyzer di Yokogawa
Il nuovo analizzatore di potenza ad alta precisione WT1500 di Yokogawa Test & Measurement...

