NewsMarket / Trends
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Infineon supplies SiC power modules to Xiaomi EVInfineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and...
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Siemens collaborates with TSMC on design tool certificationsAt the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that...
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Infineon and ETAS collaborate to optimize security of next-generation AURIX MCUInfineon Technologies has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the...
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KDPOF collaborates with Hinge TechnologyKDPOF announced their strategic partnership with Hinge Technology to solve key technical issues in...
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Intel welcomes Open Platform for enterprise AIThe Linux Foundation AI & Data announced the Open Platform for Enterprise AI (OPEA)...
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Infineon provides FOXESS with power semiconductorsInfineon Technologies supplies its power semiconductor devices to FOXESS, a fast-growing company in the...
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Anglia Live expands footprint into EuropeAnglia Components PLC recently announced it is bringing the Anglia Live eCommerce platform to...
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Renesas expand its power semiconductor production capacityRenesas Electronics announced that it has started operations at its Kofu Factory, located in...
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VIA optronics and Antolin unveil SunriseVIA optronics and Grupo Antolin–Irausa, a global provider of automotive technology solutions, recently unveiled...
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Advantest and Toray Engineering establish technical partnershipAdvantest Corporation announced that it has entered into a technical partnership with Toray Engineering...
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Infineon and Amkor deepen partnershipInfineon Technologies is strengthening its outsourced backend manufacturing footprint in Europe and announced a...
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Nordic Semiconductor showcases Thingy:91 XAt embedded world Nordic Semiconductor will share a preview of its breakthrough “Thingy:91 X”,...
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Green Hills Software delivers new solutions for NXP’s Open S32 CoreRide platformGreen Hills Software announced its significant role in NXP Semiconductors’ open S32 CoreRide platform,...
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SECO and NXP collaborate to bring Clea to industrial and IoT applicationsSECO announced it is working with NXP Semiconductors to bring SECO’s Clea software solution...
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Infineon presents innovative solutions for a greener future at embedded world 2024At embedded world 2024, Infineon Technologies will demonstrate how its innovative semiconductor solutions support...
News/Analysis Tutti ▶
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Anritsu ha presentato il VNA TensorAnritsu ha presentato il suo VNA (analizzatore di rete vettoriale) Tensor per l’analisi delle reti...
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Una soluzione integrata da Teradyne e Tokyo ElectronTeradyne ha sviluppato insieme a Tokyo Electron (TEL) una soluzione integrata che combina la...
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GlobalFoundries e Qualinx per la produzione di chip europeiGlobalFoundries (GF) e Qualinx hanno dimostrato che i chip critici dal punto di vista...
Products Tutti ▶
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Load switch intelligenti da DiodesDiodes ha ampliato la sua offerta di load switch con il modello DML1012ALDSQ, un...
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Microchip rilascia nuovi retimer PCIe 6.0 e CXL 3.1Microchip ha aggiunto alla sua offerta di prodotti per data center i retimer XpressConnect...
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Murata: nuovi convertitori DC-DC ad alto isolamentoMurata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...
