Components-en
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GaN performance in NXP’s multi-chip modules for 5G infrastructure
NXP Semiconductors announced the integration of Gallium Nitride (GaN) technology to its multi-chip module...
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New Lattice CertusPro-NX general purpose FPGAs
Lattice Semiconductor launched the Lattice CertusPro-NX general purpose FPGA family. As the fourth device...
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Convection cooled 350W medical power supplies from TDK-Lambda
TDK Corporation announces the introduction of the TDK-Lambda CUS350MP series of AC-DC power supplies...
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Silanna Semiconductor extends CO2 Smart Power DC/DC product family
Silanna Semiconductor has extended its CO2 Smart Power family of wide-voltage, high-frequency point of...
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Toshiba expands scope of its solid-state LiDAR solution
Toshiba Corporation has announced an updated version of its solid-state LiDAR solution. This new...
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Accelleran’s 5G dRAX cloud-native OpenRAN software now available
Accelleran announces the availability of 5G Standalone dRAX cloud-native OpenRAN software components. dRAX implements...
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1200 V power modules of the Infineon CIPOS Maxi SiC IPM IM828 series at Rutronik.
CIPOS Maxi SiC IPM is a 55 mΩ three-phase CoolSiC MOSFET-based open emitter intelligent...
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Centimeter-level GPS technology for precise positioning
u-blox has released a firmware update for its ZED-F9R positioning module, bringing robust centimeter-level...
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Teledyne e2v : fully space-qualified 4-channel ADC
Teledyne e2v’s EV12AQ600 has just been confirmed as the industry’s first 4-channel analog-to-digital converter...
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Infineon presents a fully programmable three-phase driver IC
To enable the next generation of innovative and high-performance battery-powered products, Infineon Technologies expands...
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Automotive-compliant LED driver from Diodes Incorporated
Diodes Incorporated has expanded its portfolio of devices supporting automotive exterior illumination with the...
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Infineon launches new OptiMOS packages in TOLx family
Infineon Technologies offers more choices to power system designers to meet diverse design needs...
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ARIES Embedded expands SoM product range
ARIES Embedded has started volume production of the M100PFS System-on-Module (SoM). The platform is...
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Allegro’s new 3DMAG magnetic position sensor
Allegro MicroSystems announced the release of the A31315 sensor, the newest member of the...
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GPIO Expanders from Diodes Incorporated
Diodes Incorporated has announced 16-bit PI4IOE5V6416Q and 34-bit PI4IOE5V6534Q bidirectional voltage-level translation general-purpose I/O...
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KYOCERA AVX launches new solderless WTB card-edge connectors
KYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
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Renesas completes acquisition of Transphorm
Renesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
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Linxens and Nocturnal join forces to accelerate the development of innovative medical devices
Linxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
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Advantech launches ITA-168/178 series
Advantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2
Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROE
MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...

