Components-en
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Infineon expands Prime Switch family
Infineon expands the high-power Prime Switch family with the new Press Pack IGBT (PPI)...
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u-blox announces a tri-radio module
u-blox has announced the u-blox MAYA-W2 tri-radio module. Supporting Wi-Fi 6, Bluetooth low energy...
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High efficiency low voltage 3A buck converter from Diodes Incorporated
Diodes Incorporated has introduced the automotive-compliant DIODES AP61300Q synchronous buck converters. These 3A-rated devices...
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M12 adapter from PROVERTHA with X to D and D to X coding
Provertha has developed a robust and extremely compact M12 adapter solution that allows a...
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Nexperia widens its offering of discrete components in DFN packaging with side-wettable flanks
Nexperia announced its latest product additions to a growing range of discrete devices which...
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Antenova’s new small dual-band antenna for IoT
Antenova launches a new low-profile antenna for Europe’s 868 MHz bands and the US...
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VIAVI releases ALT-9000 radio altimeter test solution
VIAVI Solutions announced the launch of the ALT-9000 universal radio altimeter (RADALT) flight line...
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Space-saving Schottky rectifiers from Diodes Incorporated
Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in...
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Magnachip introduces a new 40V MOSFET for BLDC motors
Magnachip Semiconductor announced that the company has released a new 40V Metal-Oxide-Semiconductor Field-Effect Transistor...
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Winbond and Infineon extend collaboration with double bandwidth HyperRAM 3.0
Winbond Electronics with Infineon Technologies have announced the expansion of their HYPERRAM product collaboration...
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VPC hybrid capacitors from VINATech replace batteries
VINATech has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used...
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Infineon extends CoolSiC M1H technology portfolio
Infineon Technologies introduces a new CoolSiC technology: the CoolSiC MOSFET 1200 V M1H. The...
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A new generation of 3D touchless user interfaces
TouchNetix announces fully integrated aXiom touchscreen chips which offer new 3D sensing capabilities by...
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Panasonic Industry’s new Solid Polymer capacitors
Panasonic Industry‘s SP-Cap (Solid Polymer ) portfolio of Aluminum Polymer capacitors is an interesting...
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The Capacitive Hidden Switch from Schurter now at Rutronik
The Capacitive Hidden Switch (CHS) from Schurter, available at Rutronik, functions entirely without mounting...
News/Analysis Tutti ▶
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
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NXP integra radio e audio per l’automotive
SAF9800 è un nuovo processore audio e radio di NXP destinato al settore automotive....
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Partnership tra Intel e Fortinet per SP6
Intel e Fortinet hanno annunciato una collaborazione strategica finalizzata allo sviluppo del Fortinet Security...
Products Tutti ▶
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...
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Il nuovo power analyzer di Yokogawa
Il nuovo analizzatore di potenza ad alta precisione WT1500 di Yokogawa Test & Measurement...

