Components-en
-
Infineon expands Prime Switch family
Infineon expands the high-power Prime Switch family with the new Press Pack IGBT (PPI)...
-
u-blox announces a tri-radio module
u-blox has announced the u-blox MAYA-W2 tri-radio module. Supporting Wi-Fi 6, Bluetooth low energy...
-
High efficiency low voltage 3A buck converter from Diodes Incorporated
Diodes Incorporated has introduced the automotive-compliant DIODES AP61300Q synchronous buck converters. These 3A-rated devices...
-
M12 adapter from PROVERTHA with X to D and D to X coding
Provertha has developed a robust and extremely compact M12 adapter solution that allows a...
-
Nexperia widens its offering of discrete components in DFN packaging with side-wettable flanks
Nexperia announced its latest product additions to a growing range of discrete devices which...
-
Antenova’s new small dual-band antenna for IoT
Antenova launches a new low-profile antenna for Europe’s 868 MHz bands and the US...
-
VIAVI releases ALT-9000 radio altimeter test solution
VIAVI Solutions announced the launch of the ALT-9000 universal radio altimeter (RADALT) flight line...
-
Space-saving Schottky rectifiers from Diodes Incorporated
Diodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in...
-
Magnachip introduces a new 40V MOSFET for BLDC motors
Magnachip Semiconductor announced that the company has released a new 40V Metal-Oxide-Semiconductor Field-Effect Transistor...
-
Winbond and Infineon extend collaboration with double bandwidth HyperRAM 3.0
Winbond Electronics with Infineon Technologies have announced the expansion of their HYPERRAM product collaboration...
-
VPC hybrid capacitors from VINATech replace batteries
VINATech has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used...
-
Infineon extends CoolSiC M1H technology portfolio
Infineon Technologies introduces a new CoolSiC technology: the CoolSiC MOSFET 1200 V M1H. The...
-
A new generation of 3D touchless user interfaces
TouchNetix announces fully integrated aXiom touchscreen chips which offer new 3D sensing capabilities by...
-
Panasonic Industry’s new Solid Polymer capacitors
Panasonic Industry‘s SP-Cap (Solid Polymer ) portfolio of Aluminum Polymer capacitors is an interesting...
-
The Capacitive Hidden Switch from Schurter now at Rutronik
The Capacitive Hidden Switch (CHS) from Schurter, available at Rutronik, functions entirely without mounting...
News/Analysis Tutti ▶
-
Cosmic Semiconductor Solutions a Pcim Europe 2026
Cosmic parteciperà per la prima volta a Pcim Europe 2026, evento che si terrà a...
-
29 premi per DigiKey
In occasione dell’EDS Leadership Summit 2026, evento tenutosi dal 18 al 22 maggio a...
-
Le previsioni di Wsts sui semiconduttori per il 2026
L’organizzazione World Semiconductor Trade Statistics (Wsts) ha rivisto sensibilmente al rialzo le sue previsioni...
Products Tutti ▶
-
Soluzione di conformità ASA-ML da Rohde & Schwarz
Rohde & Schwarz ha presentato una nuova soluzione di conformità ASA Motion Link per...
-
Emerson amplia la gamma NI PXI
Le più recenti aggiunte al portafoglio VST (Vector Signal Transceiver) NI PXI di Emerson...
-
Microchip presenta una serie di DSC essenziali
Microchip Technology ha introdotto una nuova famiglia di Digital Signal Controller (DSC) che permette...


