Tag per "d2d"
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Tecnologia CoWoS di TSMC per il nuovo sottosistema di Alphawave SemiAlphawave Semi ha annunciato la disponibilità del primo sottosistema Die-to-Die (D2D) Universal Chiplet Interconnect...
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Keysight introduces Chiplet PHY Designer for simulating D2D to D2D PHY IP supporting the UCIe standardKeysight Technologies introduces Chiplet PHY Designer, the latest member in its family of high...
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KYOCERA AVX launches new solderless WTB card-edge connectorsKYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
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Renesas completes acquisition of TransphormRenesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
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Linxens and Nocturnal join forces to accelerate the development of innovative medical devicesLinxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
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Advantech launches ITA-168/178 seriesAdvantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROEMIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
