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Joint venture for a new semiconductor assembly and test facility in India
CG Power and Industrial Solutions Limited (CG), a part of Tube Investments of India...
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SABIC launches new LNP compound
SABIC introduced LNP THERMOCOMP OFC08V compound, a material well suited for 5G base station...
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Imperas updates free reference model riscvOVPsimPlus
Imperas Software announces the latest updates to riscvOVPsimPlus with support for the near ratified...
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New reference design for enhanced 3D computer vision for edge AI
Blaize and eYs3D Microelectronics, the image processor solution provider enabling enhanced 3D computer vision...
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Xilinx: machine-learning optimization for accelerated designs
Xilinx introduced Vivado ML Editions, the industry’s first FPGA EDA tool suite based on...
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The u-blox ‘s cloud location service brings power autonomy to constrained IoT devices
u-blox has introduced a service that offloads the position calculation from IoT devices into...
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A new type of transistor from SFN
Bizen, a new wafer process technology, has been verified by physical wafer results and...
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DATA MODUL presents easyANALYZER 4.0
easyTOUCH is the name of the PCAP/PCT (projective capacitive) touch system for industrial applications...
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New Infineon HybridPACK power modules for xEV
Infineon Technologies introduces four new HybridPACK Drive modules optimized for different inverter performance levels...
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Kontron: new KISS rackmount PC in 1U Format
Kontron presents the KISS 1U Short V3 CFL Rackmount PC, a particularly compact member...
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Intersil’s New Radiation-Tolerant Plastic ICs for satellite
Intersil announced the first three members of its new family of radiation-tolerant plastic-package ICs...
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Swissbit: industrial eMMC EM-20
Swissbit presents EM-20, embedded Multimedia cards with capacities from 8 to 64 GB, for...
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Keysight Technologies: R&D toolset for 5G protocol
Keysight Technologies announced a 5G protocol test solution designed to support chipset and device...
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MaxLinear to acquire Exar
MaxLinear will acquire rival analog chip maker Exar Corp. for about $700 million in...
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ON Semiconductor: new modular automotive imaging platform
ON Semiconductor has introduced the Modular Automotive Reference System (MARS) that gives system and...
News/Analysis Tutti ▶
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Le previsioni di TrendForce per le memorie
Gli analisti di TrendForce indicano che l’attuale tensione nell’approvvigionamento delle memorie diminuirà nella seconda...
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Certificazione di sicurezza per i computer Moxa
I computer Moxa della serie UC basati su architettura Arm a 64 bit che...
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
Products Tutti ▶
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Amphenol: nuovi connettori compatti
Amphenol Industrial Operations ha introdotto nella sua offerta di connettori la nuova serie ePower-Lite...
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...

