NEWS / ANALYSIS
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Intel Launches Agilex 7 FPGAs with R-Tile
Intel‘s Programmable Solutions Group launched the Intel Agilex 7 with the R-Tile chiplet. It...
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Inova Semiconductors achieves a hat-trick: F.A.Z.-Institut honours the company as an innovation leader in Germany for the third year in a row
The F.A.Z.-Institut – a subsidiary of the Frankfurter Allgemeine Zeitung – ranks Inova Semiconductors...
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Renesas expands focus on India with new NB-IoT solution
Renesas Electronics introduced an NB-IoT (Narrowband Internet of Things) chipset specifically for the Indian...
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Danisense to exhibit at PCIM 2023
Danisense will be exhibiting at PCIM 2023 in Nuremberg from 9th to 11th May...
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Infineon enables innovative solution for second life of electric passenger car batteries
STABL Energy uses MOSFETs from Infineon Technologies to make stationary energy storage systems from...
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Partnership between Parasoft and TASKING
Parasoft has announced a partnership with TASKING. The partnership offers an integrated software development...
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SatixFy Communications and Presto Engineering announce partnership
SatixFy Communications announced a strategic partnership with Presto Engineering. This partnership supports SatixFy’s growth...
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Intel Foundry and Arm announce multigeneration collaboration
Intel Foundry Services (IFS) and Arm announced a multigeneration agreement to enable chip designers...
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Pre-Switch, appoints ex-Audi inverter designer as new CTO
Pre-Switch has appointed Jacek Borecki as Chief Technology Officer. Previously, Borecki was the senior...
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ROHM presents high-performance solutions
At PCIM Europe ROHM Semiconductor will showcase its new power semiconductors, including high-performance solutions...
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Sondrel signs EDA license extension with Siemens for three more years
Sondrel has secured the continuity of its use of Siemens EDA software with a...
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GlobalData: GPT-4 ignites race for artificial general intelligence
The recent launch of GPT-4 by OpenAI is likely to open the chase for...
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KYOCERA AVX antenna simulation models available in Ansys HFSS 3D electromagnetic simulation software
KYOCERA AVX announced that direct links to simulation models for its embedded antennas are...
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SECORA Pay portfolio available in 28 nm chip technology
Infineon Technologies expands its SECORA Pay solutions portfolio to 28 nm technology. With this,...
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Ultra-low-power bi-directional wireless mesh network modules from NeoCortec now available at TME
NeoCortec has recently signed a new global distribution agreement with Poland based distributor TME...
Products read all ▶
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Advantech launches ITA-168/178 series
Advantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2
Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROE
MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
