NEWS / ANALYSIS
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Alps Alpine commences external sales of ICs
Alps Alpine announced the commencement of external sales of ICs, which were formerly designed...
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Pulsiv to deliver groundbreaking USB-C reference designs & finished modules with more than 95% average efficiency
Pulsiv Limited is set to release a series of reference designs and assembled modules...
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Infineon sells manufacturing sites in Cavite, Philippines and Cheonan, South Korea to ASE
Infineon Technologies and ASE Technology Holding announced that definitive agreements were signed under which...
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IAR unveils the latest Functional Safety version of IAR Embedded Workbench for Arm
IAR announced the release of the latest version 9.50.3 of its IAR Embedded Workbench...
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GlobalData: influencers laud NVIDIA Chat with RTX AI chatbot as game-changer for Windows PCs
NVIDIA recently launched the “Chat with RTX“, an AI-powered chatbot that facilitates enhanced conversations...
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GCF: Mobile Device Trends February 2024
The Global Certification Forum (GCF) published its Mobile Device Trends February 2024 report, which...
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Empower Semiconductor to showcase high-density power chiplets and embedded IVRs at APEC 2024
Empower Semiconductor will exhibit its latest generation of IVRs at the IEEE Applied Power...
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German components distribution: slight sales growth in 2023, negative outlook for 2024
In the fourth quarter, the weak order intake of the last few quarters clearly...
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u-blox introduces new LTE-M modules for industrial connectivity
u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52. These...
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Driving the Future: FPGAs and the Technological Evolution of Automotive In-Cabin Experiences
Mark Hoopes, Director, Industrial & Automotive Segment at Lattice Semiconductor The Automotive industry is...
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METIS issues report outlining top skills needed by european microelectronics industry
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced...
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TASKING: new version of the VX-Toolset for Arm
TASKING introduces the new version v7.0r1 of the VX-Toolset for Arm compiler toolchain, the...
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Qualinx partners with EU Space Agency
Qualinx is partnering with the European Union Agency for the Space Programme (EUSPA) under...
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Keysight introduces Chiplet PHY Designer for simulating D2D to D2D PHY IP supporting the UCIe standard
Keysight Technologies introduces Chiplet PHY Designer, the latest member in its family of high...
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Advantech-Innocore releases latest high-end performance gaming platform
Advantech-Innocore has announced the launch of the latest product of the DPX-S Series gaming...
News/Analysis Tutti ▶
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Sempre più Intelligenza Artificiale per Emerson
Emerson ha introdotto nuovi miglioramenti a NI Nigel AI, estendendone le funzionalità all’intero portafoglio...
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Partnership tra TDK e LG Innotek
TDK e LG Innotek hanno annunciato di aver siglato una partnership strategica per l’Intelligenza...
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Le previsioni di TrendForce per le memorie
Gli analisti di TrendForce indicano che l’attuale tensione nell’approvvigionamento delle memorie diminuirà nella seconda...
Products Tutti ▶
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I nuovi isolatori a stato solido di Infineon
Infineon ha introdotto una nuova tecnologia per gli isolatori a stato solido (SSI) che...
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Amphenol: nuovi connettori compatti
Amphenol Industrial Operations ha introdotto nella sua offerta di connettori la nuova serie ePower-Lite...
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...

