NEWS / ANALYSIS
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Alps Alpine commences external sales of ICs
Alps Alpine announced the commencement of external sales of ICs, which were formerly designed...
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Pulsiv to deliver groundbreaking USB-C reference designs & finished modules with more than 95% average efficiency
Pulsiv Limited is set to release a series of reference designs and assembled modules...
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Infineon sells manufacturing sites in Cavite, Philippines and Cheonan, South Korea to ASE
Infineon Technologies and ASE Technology Holding announced that definitive agreements were signed under which...
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IAR unveils the latest Functional Safety version of IAR Embedded Workbench for Arm
IAR announced the release of the latest version 9.50.3 of its IAR Embedded Workbench...
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GlobalData: influencers laud NVIDIA Chat with RTX AI chatbot as game-changer for Windows PCs
NVIDIA recently launched the “Chat with RTX“, an AI-powered chatbot that facilitates enhanced conversations...
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GCF: Mobile Device Trends February 2024
The Global Certification Forum (GCF) published its Mobile Device Trends February 2024 report, which...
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Empower Semiconductor to showcase high-density power chiplets and embedded IVRs at APEC 2024
Empower Semiconductor will exhibit its latest generation of IVRs at the IEEE Applied Power...
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German components distribution: slight sales growth in 2023, negative outlook for 2024
In the fourth quarter, the weak order intake of the last few quarters clearly...
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u-blox introduces new LTE-M modules for industrial connectivity
u-blox has announced two new LTE-M cellular module series, the SARA-R52 and LEXI-R52. These...
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Driving the Future: FPGAs and the Technological Evolution of Automotive In-Cabin Experiences
Mark Hoopes, Director, Industrial & Automotive Segment at Lattice Semiconductor The Automotive industry is...
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METIS issues report outlining top skills needed by european microelectronics industry
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced...
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TASKING: new version of the VX-Toolset for Arm
TASKING introduces the new version v7.0r1 of the VX-Toolset for Arm compiler toolchain, the...
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Qualinx partners with EU Space Agency
Qualinx is partnering with the European Union Agency for the Space Programme (EUSPA) under...
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Keysight introduces Chiplet PHY Designer for simulating D2D to D2D PHY IP supporting the UCIe standard
Keysight Technologies introduces Chiplet PHY Designer, the latest member in its family of high...
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Advantech-Innocore releases latest high-end performance gaming platform
Advantech-Innocore has announced the launch of the latest product of the DPX-S Series gaming...
Products read all ▶
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Advantech launches ITA-168/178 series
Advantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2
Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROE
MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
