NewsMarket / Trends
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Intel expands FPGA portfolio
Intel expanded its Intel Agilex FPGA portfolio and broadened its Programmable Solutions Group (PSG)...
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Inventec and Renesas to jointly develop Proof-of-Concept for automotive gateways
Inventec and Renesas Electronics announced that they have agreed to jointly design automotive-grade gateway...
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Mark AB Capital partners with Blaize
Mark AB Capital announced a multi-year Memorandum of Understanding with Blaize. Blaize will offer...
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German components distribution in Q2/23: market slowdown at high sales level
Not entirely unexpectedly, the second quarter ended with both good and bad news for...
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Continental acknowledges ROHM Semiconductor with the “Supplier of the Year 2022 Award”
Continental Automotive honored ROHM Semiconductor with the “Supplier of the Year 2022 Award” for...
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Keysight enabling University of Stuttgart to advance 6G IC research
Keysight Technologies is enabling the University of Stuttgart to conduct foundational research essential to...
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New office in Bangalore for Socionext
Socionext will open its new branch office in Bangalore, India, to bolster its engineering...
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SECO cooperates with Gopalam Embedded Systems
SECO and one-stop provider of hardware and software solutions for the embedded systems market...
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Renesas to acquire Sequans
Renesas Electronics and Sequans Communications announced that the two companies have entered into a...
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Infineon to build the world’s largest 200-millimeter SiC Power Fab in Kulim
By significantly expanding its Kulim fab – over and above the original investment announced...
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NVIDIA, ServiceNow and Accenture Team to speed genAI adoption
NVIDIA, ServiceNow and Accenture announced the launch of AI Lighthouse, a first-of-its-kind program designed...
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ROHM receives Bosch Global Supplier Award 2023
ROHM ranks globally among the best suppliers of Bosch, the supplier of technology and...
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Infineon and Semikron Danfoss sign supply agreement for electromobility chips
Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply...
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TE Connectivity drives adoption of Single Pair Ethernet standard with SPE Industrial Partner Network
TE Connectivity has been a driving force behind the new IEC 63171-7 international electrotechnical...
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ROHM will acquire new production site
ROHM has reached a basic agreement with Solar Frontier K.K. to acquire the assets...
News/Analysis Tutti ▶
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Anritsu ha presentato il VNA Tensor
Anritsu ha presentato il suo VNA (analizzatore di rete vettoriale) Tensor per l’analisi delle reti...
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Una soluzione integrata da Teradyne e Tokyo Electron
Teradyne ha sviluppato insieme a Tokyo Electron (TEL) una soluzione integrata che combina la...
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GlobalFoundries e Qualinx per la produzione di chip europei
GlobalFoundries (GF) e Qualinx hanno dimostrato che i chip critici dal punto di vista...
Products Tutti ▶
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Load switch intelligenti da Diodes
Diodes ha ampliato la sua offerta di load switch con il modello DML1012ALDSQ, un...
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Microchip rilascia nuovi retimer PCIe 6.0 e CXL 3.1
Microchip ha aggiunto alla sua offerta di prodotti per data center i retimer XpressConnect...
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Murata: nuovi convertitori DC-DC ad alto isolamento
Murata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...


