NewsMarket / Trends
-
Halo Microelectronics agrees to sell Its AC-DC silicon controller IC ventureHalo Microelectronics announced an agreement to sell the remaining interest in its AC-DC silicon...
-
Pickering Interfaces announces 3-pronged approach to obsolescence avoidancePickering Interfaces announced the company’s formal approach to protecting customers from one of the...
-
Semtech Corporation completes acquisition of Sierra WirelessSemtech Corporation and Sierra Wireless announced the completion of Semtech’s acquisition of Sierra Wireless...
-
Omdia: 69% shipment share in 2022 for chinese panel makers in industrial and public display marketBased on Omdia‘s Industrial and Public Display & OEM Intelligence Service, the industrial and...
-
Infineon cooperate with Fingerprints Cards for biometric payment cardsInfineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialization...
-
Bel appoints Global ESG DirectorBel Fuse announced the appointment of Ping Gencianeo as its new Global ESG Director....
-
Infineon Austria cooperates with University of ZagrebInfineon Austria and the Faculty of Electrical Engineering and Computing (FER) at the University...
-
CEVA celebrates 15 billionth CEVA-powered chip shippedCEVA announced that cumulative royalty-bearing chip shipments that include CEVA IP surpassed 15 billion...
-
FBDi association: strong second quarter for the German components distributionA brilliant second quarter of 2022 continues to let the German component distribution dream...
-
EBV Elektronik awarded 2021 Best Performing Distributor in EMEA by STMicroelectronicsEBV Elektronik has been recognised by STMicroelectronics as the “2021 Best Performing Distributor in...
-
IC Insights: O-S-D bulletinWorldwide sales of optoelectronics, sensors and actuators, and discrete semiconductors (O-S-D) each climbed to...
-
AMD completes acquisition of XilinxAMD announced that it has completed the acquisition of Xilinx, creating the high-performance and...
-
System-in-Package industry will reach more than $19B by 2026System-in-Package Technology and Market Trends 2021 report from Yole Développement (Yole) say that the...
-
Dialog Semiconductor extends partnership with SiFiveDialog Semiconductor announced that it has extended its partnership with SiFive. Dialog is SiFive’s...
-
Zigbee Alliance change its name to Connectivity Standards AllianceThe Zigbee Alliance announced its organizational rebrand to the Connectivity Standards Alliance (CSA). The...
News/Analysis Tutti ▶
-
Anritsu ha presentato il VNA TensorAnritsu ha presentato il suo VNA (analizzatore di rete vettoriale) Tensor per l’analisi delle reti...
-
Una soluzione integrata da Teradyne e Tokyo ElectronTeradyne ha sviluppato insieme a Tokyo Electron (TEL) una soluzione integrata che combina la...
-
GlobalFoundries e Qualinx per la produzione di chip europeiGlobalFoundries (GF) e Qualinx hanno dimostrato che i chip critici dal punto di vista...
Products Tutti ▶
-
Load switch intelligenti da DiodesDiodes ha ampliato la sua offerta di load switch con il modello DML1012ALDSQ, un...
-
Microchip rilascia nuovi retimer PCIe 6.0 e CXL 3.1Microchip ha aggiunto alla sua offerta di prodotti per data center i retimer XpressConnect...
-
Murata: nuovi convertitori DC-DC ad alto isolamentoMurata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...
