Nexperia: 80% smaller automotive power MOSFET package

Nexperia announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80% smaller than industry standard devices.

The Nexperia LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9 mm2, and because no wires or glue is used internally, operating temperatures of up to 175oC T-j max are possible.

Devices can handle up to 70 A, and the extensive product portfolio includes devices that range between 30 V – 100 V and an RDS(on) as low as 6.3 mΩ.

LFPAK33 MOSFETs enable the power infrastructure that allows next-generation automotive subsystems such as radar and ADAS technology to operate reliably and efficiently. Target applications include: connected auto modules, next generation engine management systems; chassis and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS.

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