News
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ROHM and BASiC Semiconductor form a strategic partnership
Shenzhen BASiC Semiconductor and ROHM have entered into a strategic partnership agreement on SiC...
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AMD and Viettel collaborate on 5G mobile network expansion
AMD and Viettel High Tech announced the successful completion of a 5G mobile network...
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Siemens streamlines medical standards compliance for Linux OS based systems
Siemens Digital Industries Software introduced the first software documentation package developed to help original...
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ROHM develops ultra-low-power on-device learning edge AI chip
ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator)...
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The first time electronic passport security for the quantum computer era
Infineon Technologies, the German Federal Printing Office (Bundesdruckerei GmbH) and the Fraunhofer Institute for...
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ROHM, Mazda and Imasen sign a joint agreement
ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen...
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AMD: first adaptive SoC fully certified for automotive functional safety applications
AMD completed the functional safety certification of Zynq UltraScale+ Full-Power Domain (FPD) and Programmable...
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Neways signs contract with BAE Systems Hägglunds
Neways signed a contract with BAE Systems Hägglunds at electronica 2022 for the mid-life...
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Nicomatic announces global distribution partnership with PEI-Genesis
Nicomatic announces a global distribution agreement with PEI-Genesis, headquartered in Philadelphia, Pennsylvania. The partnership...
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TTI Europe acquires Ecopac Power
TTI Europe has completed the acquisition of Ecopac (UK) Power a specialist UK &...
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LoRa Alliance announces new LoRaWAN payload codec API feature
The LoRa Alliance announced that it has expanded the LoRaWAN standard with the addition...
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Avicena acquires microLED fab facility and engineering team from Nanosys
Avicena announced that it has completed the acquisition of a microLED fabrication facility and...
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Rutronik achieves a new record in the logistics warehouse located in Eisingen
Rutronik Elektronische Bauelemente achieved a new all-time high in the logistics sector in September....
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Infineon and VinFast extend partnership in the field of electromobility
Infineon Technologies and VinFast, Vietnam’s first global smart electric car maker, announced to extend...
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Ricoh chooses u-blox GNSS expertise for its new camera
u-blox has announced the integration of its ZOE-M8B GNSS module into the new RICOH...
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KYOCERA AVX launches new solderless WTB card-edge connectors
KYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
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Renesas completes acquisition of Transphorm
Renesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
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Linxens and Nocturnal join forces to accelerate the development of innovative medical devices
Linxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
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Advantech launches ITA-168/178 series
Advantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2
Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROE
MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...