News
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Amazon, a new entry in the chip market
Annapurna Labs Inc, a subsidiary of Amazon.com, has announced the availability of its Alpine...
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Seica selected by Hella KGaA Hueck & Co.
Seica announces that the company has been selected by Hella KGaA Hueck & Co...
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Harwin awards Digi-Key with Distributor of the Year
Harwin has named Digi-Key as its Global Distributor of the Year. In Harwin’s latest...
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Internet of Things market to nearly double by 2019
Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of...
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u-blox inaugurates new R&D center in Finland
u-blox officially inaugurated its new R&D center in Tampere, Finland. It is the company’s...
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Apple Buys Wafer Fab in San Jose
Apple Inc. has bought a wafer fab in San Jose, Calif. from analog and...
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Fairchild receives two awards from Huawei
Fairchild was recently named the ‘The Best Quality Partner’ for 2015 by Huawei and...
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Nexperia announces 2023 financial results
Nexperia announced its financial results for 2023, including strong growth in its key market...
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Infineon supplies SiC power modules to Xiaomi EV
Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and...
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Siemens collaborates with TSMC on design tool certifications
At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that...
Products read all ▶
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New SMARC module from Kontron
Kontron expands its existing SMARC portfolio with a module that features the i.MX8M Plus...
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New rev of MIKROE ’s NECTO multi-architectural IDE
MIKROE has announced that the latest version of its multi-architectural IDE, NECTO Studio 6.1,...
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Neousys debuts new IP66 waterproof computer with Intel 13th/12th-Gen Core
Neousys Technology adds a new series to its waterproof industrial computer family featuring an...