The unit is fully operational and included 197 pieces of chip manufacturing equipment from top makers – Applied Materials, Hitachi, Novellus, Tokyo Electron, KLA and ASML – suitable for production at nodes from 0.6-micron down to 90nm, with the bulk at 0.35-micron to 180nm.
Apple is unlikely to use the fab for production of its main chips, for which it uses foundries TSMC and Samsung, but could use the facility for R&D activities related to components such as mixed-signal devices, MEMS and image sensors and for packaging operations