SABIC  introduced LNP THERMOCOMP OFC08V compound, a material well suited for 5G base station...

Imperas Software announces the latest updates to riscvOVPsimPlus with support for the near ratified...

Blaize and eYs3D Microelectronics, the image processor solution provider enabling enhanced 3D computer vision...

Xilinx  introduced Vivado ML Editions, the industry’s first FPGA EDA tool suite based on...

u-blox has introduced a service that offloads the position calculation from IoT devices into...

Bizen, a new wafer process technology, has been verified by physical wafer results and...

easyTOUCH is the name of the PCAP/PCT (projective capacitive) touch system for industrial applications...

Infineon Technologies introduces four new HybridPACK Drive modules optimized for different inverter performance levels...

Kontron presents the KISS 1U Short V3 CFL Rackmount PC, a particularly compact member...

Intersil announced the first three members of its new family of radiation-tolerant plastic-package ICs...

Swissbit presents EM-20, embedded Multimedia cards with capacities from 8 to 64 GB, for...

Keysight Technologies announced a 5G protocol test solution designed to support chipset and device...

MaxLinear will acquire rival analog chip maker Exar Corp. for about $700 million in...

ON Semiconductor has introduced the Modular Automotive Reference System (MARS) that gives system and...

SEGGER introduces a software error correction (ECC) package allowing the use of the low...