Components-en
-
New Dual Status Profiled Backlights combine two colours in a single device
New from OMC, Dual Status Profiled Backlights combine two colours of emitter in a...
-
Nordic’s Wi-Fi 6 Companion IC nRF7002 at Rutronik
Nordic Semiconductor has developed the nRF7002, a companion IC, available from Rutronik, for integrating...
-
Molex Extends cable-assembly product line
Molex has extended its cable-assembly product line with the addition of innovative solutions from...
-
Magnachip enters full-scale mass production of PDFN56 MXT MOSFET
Magnachip Semiconductor announced that the company began full-scale mass production of its new 40V...
-
Schaffner’s new EMC solution for residential EV-charging stations
Schaffner has launched a new EMC solution for home-based EV-charging stations. Designers of residential...
-
Three-phase SOI-based gate driver MOTIX 6ED2742S01Q from Infineon at Rutronik
With the MOTIX 6ED2742S01Q, available at Rutronik, Infineon is launching a 160 V SOI-based...
-
Industrial-grade Silicon Carbide MOSFET from Diodes Incorporated enables higher power density
Diodes Incorporated introduces the latest addition to its portfolio of Silicon Carbide (SiC) products:...
-
DATA MODUL: new 18.5-inch FHD high brightness display with AHVA Technology
DATA MODUL presents a new 18.5-inch FHD high brightness display from AUO with AHVA...
-
New HG-F laser distance sensor from Panasonic Industry
Panasonic Industry presents the new laser distance sensor HG-F, that can detect reliably at...
-
Hirose Electric released new board-to-board connector
Hirose Electric has released the IT14 Series, a board-to-board connector supporting up to 112Gbps...
-
Cinch Connectivity expands Johnson self-fixture family of connectors
Cinch Connectivity Solutions, a Bel group company, announced the expansion of their Johnson /...
-
Kyocera AVX´s SCC automotive grade Supercapacitors at Rutronik
Kyocera AVX is expanding the SCC series to include automotive-certified supercapacitors, available at Rutronik....
-
Infineon AIROC CYW20829 SoC ready with latest Bluetooth 5.4 specification
Infineon Technologies announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready...
-
Socionext introduces new 7nm ADC and DAC for 5G Direct RF transmitters and receivers
Socionext launches a new high-speed Direct RF data converter PHY solution. This is the...
-
20Gbps 2×2 exchange switch from Diodes Incorporated
Diodes Incorporated addresses the increase in automotive computing capabilities and its accompanying high-speed interfacing...
News/Analysis Tutti ▶
-
Anritsu ha presentato il VNA Tensor
Anritsu ha presentato il suo VNA (analizzatore di rete vettoriale) Tensor per l’analisi delle reti...
-
Una soluzione integrata da Teradyne e Tokyo Electron
Teradyne ha sviluppato insieme a Tokyo Electron (TEL) una soluzione integrata che combina la...
-
GlobalFoundries e Qualinx per la produzione di chip europei
GlobalFoundries (GF) e Qualinx hanno dimostrato che i chip critici dal punto di vista...
Products Tutti ▶
-
Load switch intelligenti da Diodes
Diodes ha ampliato la sua offerta di load switch con il modello DML1012ALDSQ, un...
-
Microchip rilascia nuovi retimer PCIe 6.0 e CXL 3.1
Microchip ha aggiunto alla sua offerta di prodotti per data center i retimer XpressConnect...
-
Murata: nuovi convertitori DC-DC ad alto isolamento
Murata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...


