Components-en
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Panasonic Industry Europe expands its conductive polymer hybrid capacitor portfolio
Panasonic Industry Europe is expanding its Conductive Polymer Hybrid Capacitors SMD portfolio with a...
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New highly stable temperature compensated oscillator by Micro Crystal
Micro Crystal‘s TM-2220-C7 is a plug and play temperature compensated frequency reference for applications...
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Two new 1500pixel image sensor arrays from Toshiba
Toshiba Electronics Europe introduced two new lens reduction type CCD linear image sensors Predominantly...
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New stepping motor driver IC for automotive from Toshiba
Toshiba Electronics Europehas introduced the TB9120AFTG. This constant-current 2-phase bipolar stepping motor driver,, which...
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40V synchronous buck converters from Diodes Incorporated
Diodes Incorporated announced the AP64350Q/AP64351Q/AP64352Q series of automotive-compliant, 3.5A, synchronous buck converters for point...
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Motor System ICs from Infineon for control of small electric motors in cars
Infineon Technologies is now presenting a new product family called Motor System ICs designed...
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KEMET introduces three new series of film capacitors
KEMET announces three new series of metallized polypropylene dielectric film capacitors: C44U-M, C44P-R, and...
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Infineon: new applications for silicon carbide
Infineon Technologies adds another industry standard package to its CoolSiC MOSFET 1200 V module...
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Empower: new family of power management ICs
Empower Semiconductor announced the EP70xx, a family of power management ICs that will provide...
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Infineon: QPL-qualified SupIR-SMD package for rad hard MOSFETs
IR HiRel, an Infineon Technologies AG company, announced fourteen newly QPL–qualified radiation-hardened (rad hard)...
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Pasternack releases new line of positive slope equalizers
Pasternack, an Infinite Electronics brand, has introduced a new line of positive slope equalizers...
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New dual angle sensor demo board
The new development board PVL3M provides an XMR sensor (AMR angle sensor AA746C from...
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KEMET extends KC-LINK range
KEMET Corporation extends its KC-LINK range using KONNEKT high-density packaging technology to meet the...
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DOEs made of Low-OH quartz glass
Diffractive optical elements (DOEs) are now also available from LASER COMPONENTS on Corning 7979...
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StrongIRFET MOSFETs in D²PAK 7pin+ package targeted at battery-powered applications
Infineon Technologies AG complements its StrongIRFET 40-60 V MOSFET product family with the addition...
News/Analysis Tutti ▶
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Yole Group pubblica un report sul packaging avanzato
Yole Group ha pubblicato il report “Status of the Advanced Packaging Industry 2026″ che...
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NXP integra radio e audio per l’automotive
SAF9800 è un nuovo processore audio e radio di NXP destinato al settore automotive....
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Partnership tra Intel e Fortinet per SP6
Intel e Fortinet hanno annunciato una collaborazione strategica finalizzata allo sviluppo del Fortinet Security...
Products Tutti ▶
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Connettori RF a 30 gradi da Samtec
Samtec ha annunciato la disponibilità del nuovo connettore per schede di circuiti stampati ad...
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Rohm propone una nuova evaluation board
La nuova evaluation board BD83070GWL-EVK-002 di Rohm è stata sviluppata per valutare le caratteristiche...
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Il nuovo power analyzer di Yokogawa
Il nuovo analizzatore di potenza ad alta precisione WT1500 di Yokogawa Test & Measurement...

