Components-en
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PCI Express 3.0 packet switch from Diodes Incorporated
Diodes Incorporated has announced the PI7C9X3G816GP, a PCIe 3.0 packet switch that supports 16-lane...
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ESD protection for USB4 standard interfaces from Nexperia
Nexperia announced two PESD5V0R1BxSF extremely low clamping and capacitance bidirectional Electrostatic Discharge (ESD) protection...
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KEMET Introduces EMI X2 film capacitor solution for harsh environments
KEMET announces its new R53 series of miniature, polypropylene film X2 EMI suppression capacitors....
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The new roud display moduel POS-I-PRO from Distec
Distec presents the round TFT display series POS-I-PRO opens up completely new possibilities for...
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Commercial IHLP inductor in 7575 package from Vishay at Rutronik
Intended for computer, telecommunications and industrial applications, Vishay Dale‘s IHLP-7575GZ-51 inductor, available at Rutronik,...
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Switched capacitor intermediate bus converter for 48 V data center applications
Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter (IBC)...
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Panasonic Industry launches the new double-row CF2 connector
Panasonic Industry announces the new connector CF2 type coming with 20 pins in two...
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New dual-band Wi-Fi 5 and Bluetooth 5 module from Panasonic
Panasonic Industry introduces the PAN9028, a dual band 2.4 GHz and 5 GHz 802.11...
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Augmented reality with Infineon’s new MEMS scanner for eyeglasses and head-up displays
The new MEMS scanner solution from Infineon Technologies, comprising a MEMS mirror and MEMS...
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Infineon and Panasonic accelerate GaN technology development
Infineon Technologies and Panasonic Corporation have signed an agreement for the joint development and...
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New RF amplifiers from Ampleon
Ampleon has announced a further expansion to its portfolio of next generation amplifier ICs....
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Renesas expands ProXO oscillator portfolio
Renesas Electronics expanded its robust timing solutions portfolio with the ProXO+ family of compact,...
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Xilinx and Motovis introduce complete solution for automotive forward camera
Xilinx and Motovis, a provider of embedded AI autonomous driving, announced that the two...
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Nexperia presents two new ASFETs
Nexperia announced new 80 V and 100 V ASFETs (Application-Specific MOSFETs ) with enhanced...
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Renesas and Syntiant develop voice-controlled multimodal AI solution
Renesas Electronics and Syntiant announced the joint development of a voice-controlled multimodal AI solution...
News/Analysis Tutti ▶
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Anritsu ha presentato il VNA Tensor
Anritsu ha presentato il suo VNA (analizzatore di rete vettoriale) Tensor per l’analisi delle reti...
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Una soluzione integrata da Teradyne e Tokyo Electron
Teradyne ha sviluppato insieme a Tokyo Electron (TEL) una soluzione integrata che combina la...
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GlobalFoundries e Qualinx per la produzione di chip europei
GlobalFoundries (GF) e Qualinx hanno dimostrato che i chip critici dal punto di vista...
Products Tutti ▶
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Load switch intelligenti da Diodes
Diodes ha ampliato la sua offerta di load switch con il modello DML1012ALDSQ, un...
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Microchip rilascia nuovi retimer PCIe 6.0 e CXL 3.1
Microchip ha aggiunto alla sua offerta di prodotti per data center i retimer XpressConnect...
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Murata: nuovi convertitori DC-DC ad alto isolamento
Murata Manufacturing ha annunciato la serie di convertitori DC-DC isolati MGJ1T, una nuova gamma...


