Empower Semiconductor to showcase high-density power chiplets and embedded IVRs at APEC 2024 - Elettronica Plus

Empower Semiconductor to showcase high-density power chiplets and embedded IVRs at APEC 2024

Posted 15 febbraio 2024
Empower Semiconductor

Empower Semiconductor will exhibit its latest generation of IVRs at the IEEE Applied Power Electronics Conference and Exposition (APEC), taking place at the Long Beach Convention and Entertainment Center, February 25-29, 2024.

The company will demonstrate the latest additions to its family of IVRs at booth #2044. The ultra-fast EP71xx family of multi-rail, multi-phase regulators delivers upwards of 20W in 35mm2 and eliminates all external components, shrinking board space by 3x, to provide the most compact and highest performance solution in the industry. Now available on interposers or coupled with off-the-shelf inductors, embedded systems designers have additional choices to further simplify and accelerate the design-in process while raising the bar for efficiency. Combined with its ECAP ultra-low ESL silicon capacitor products, Empower’s power management solutions achieve an unprecedented level of compactness and performance for any space constrained data-intensive applications.



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