Xilinx expands UltraScale+ portfolio

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Xilinx  has expanded its UltraScale+ portfolio with form factors that are 70 percent smaller than traditional chip-scale packaging.

The new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world’s only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art InFO (Integrated Fan-Out) packaging technology.

The Artix UltraScale+ family is built on its production-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact “8K-ready” video broadcasting.

Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 and production-proven ZU2 and ZU3 devices, all available in InFO packaging. As part of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is designed for connectivity at the edge and for industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications.

The first cost-optimized Artix UltraScale+ devices are expected to be available in production by Q3 CY2021, with Vivado Design Suite and Vitis Unified Software Platform tool support starting late summer. Zynq UltraScale+ ZU1 devices will also begin sampling in Q3 with tool support in Q2, and volume production of the extended portfolio beginning Q4.

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