At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with long time partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes. For mutual customers, these certifications allow the development of innovative and highly differentiated end-products using best-in-class EDA software and industry-leading silicon process and advanced packaging technologies.
“Siemens is pleased to collaborate with TSMC to deliver EDA technologies that provide customers with an expanding number of design avenues, even as time, cost and design complexity pressures continue to rise,” said Mike Ellow, executive vice president, Electronic Design Automation, Siemens Digital Industries Software. “The combination of Siemens’ industry-leading IC design solutions and TSMC’s leading-edge process and advanced packaging techonlogies enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.”
“Siemens has been a long-time, strategic partner and continues to increase its value to the TSMC Open Innovation Platform (OIP) ecosystem by offering more high quality solutions in support of our newest leading-edge technologies,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We look forward to seeing even more innovations as we continue to further grow our strong and highly-valued partnership that helps to enable our customers’ leadership in HPC and AI by bringing to market even more differentiated semiconductor designs.”