Siemens collaborates with TSMC on design tool certifications
At the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that ongoing collaboration with long time partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes. For mutual customers, these certifications allow the development of innovative and highly differentiated end-products using best-in-class EDA software and industry-leading silicon process and advanced packaging technologies.
“Siemens is pleased to collaborate with TSMC to deliver EDA technologies that provide customers with an expanding number of design avenues, even as time, cost and design complexity pressures continue to rise,” said Mike Ellow, executive vice president, Electronic Design Automation, Siemens Digital Industries Software. “The combination of Siemens’ industry-leading IC design solutions and TSMC’s leading-edge process and advanced packaging techonlogies enable our many mutual customers to achieve truly remarkable and industry-disrupting innovations.”
“Siemens has been a long-time, strategic partner and continues to increase its value to the TSMC Open Innovation Platform (OIP) ecosystem by offering more high quality solutions in support of our newest leading-edge technologies,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “We look forward to seeing even more innovations as we continue to further grow our strong and highly-valued partnership that helps to enable our customers’ leadership in HPC and AI by bringing to market even more differentiated semiconductor designs.”
Contenuti correlati
-
Pulsiv & Astute Electronics join forces to co-exhibit at PCIM Europe 2024
Pulsiv Limited is joining forces with global electronics distributor and supply-chain expert Astute Group to co-exhibit at PCIM Europe. Following the recent expansion of their distribution agreement, this collaboration demonstrates a firm and strategic commitment by both...
-
Infineon enhances the TRAVEO T2G MCU family with Qt Group graphics solution
Infineon Technologies announces its strategic collaboration with Qt Group, a global software company providing cross-platform solutions for the entire software development lifecycle. This collaboration brings Qt’s lightweight, high-performance graphics framework to Infineon’s graphics-enabled TRAVEO T2G cluster microcontrollers...
-
Socionext announces collaboration with Arm and TSMC
Socionext announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of-network markets....
-
Nokia and Presto Engineering are advancing 5G/6G networks as part of France 2030 investment plan
Presto Engineering, a expert in ASIC design and semiconductor engineering and production services, announced its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links as...
-
Isorg collaborates with Precise Biometrics for fingerprint sensor solution
Isorg announces further details on the company’s collaboration with Precise Biometrics on a new Fingerprint on Display (FoD) solution for the mobile industry. While increasing resolution unquestionably remains a major trend within the display industry – such...
-
Lockheed Martin and Keysight test 5G solutions for aerospace and defense communications
Lockheed Martin and Keysight Technologies announced a collaboration to advance 5G in support of mission-critical communications for aerospace and defense applications. The companies are actively collaborating on a 5G.MIL testbed Lockheed Martin teams will use to advance...
-
Xilinx and Motovis introduce complete solution for automotive forward camera
Xilinx and Motovis, a provider of embedded AI autonomous driving, announced that the two companies are collaborating on a solution that pairs the Xilinx Automotive (XA) Zynq system-on-chip (SoC) platform and Motovis’ convolutional neural network (CNN) IP...
-
NI acquires monoDrive and announces a strategic collaboration with Ansys
NI announced it has acquired monoDrive, a leader in ultra-high fidelity simulation software for advanced driver-assistance systems (ADAS) and autonomous vehicle development. The acquisition expands NI’s reach in the ADAS and simulation markets and will enable NI’s...
-
UTAC and AEM to jointly develop CMOS Image Sensor Test Systems and Solution
UTAC Holdings Ltd, a Singapore-based semiconductor assembly and test services provider, and AEM Holdings Ltd, a Singapore-based provider of the semiconductor test and handling solutions jointly announced a plan to collaborate and jointly develop the next-generation, cost-effective...