Siemens and ASE introduce enablement technologies for next-generation package designs

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Siemens Digital Industries Software announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) has generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in an easy-to-use, data-robust graphical environment prior to and during physical design implementation.

The new high-density advanced packaging (HDAP) enablement solutions stem from ASE’s participation in the Siemens OSAT Alliance – a program designed to drive faster adoption of new HDAP technologies like 2.5D, 3D IC and Fan-Out wafer-level packaging (FOWLP) for next-generation IC designs. ASE is a leading provider of independent semiconductor assembling and test manufacturing services.

ASE’s latest achievements as part of the OSAT Alliance include an assembly design kit (ADK) that helps customers using ASE’s Fan Out Chip on Substrate (FOCoS) and 2.5D Middle End of Line (MEOL) technologies to fully leverage the Siemens HDAP design flow. ASE and Siemens have also agreed to extend their partnership to include the future creation of a single design platform from FOWLP to 2.5D substrate design. All of these joint initiatives leverage Siemens’ Xpedition Substrate Integrator software and Calibre 3DSTACK platform.

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