NewsMarket / Trends
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DATA MODUL: successful participation in the innovation competitionRanga Yogeshwar congratulates DATA MODUL from Munich on being awarded the TOP 100 Seal....
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Renesas and Wolfspeed sign 10 year Silicon Carbide wafer supply agreementRenesas Electronics Corporation and Wolfspeed announced the execution of a wafer supply agreement and...
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Infineon and Kontrol join forces to improve the safety of autonomous vehiclesInfineon Technologies and the Austrian product compliance company Kontrol are entering into a strategic...
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OKI IDS adopts Siemens Catapult High-Level Synthesis platform for design and verification servicesSiemens Digital Industries Software announces that OKI IDS has adopted Siemens Catapult software for...
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RS Components and CUI Devices enter into distribution agreementCUI Devices announced that it has signed a distribution agreement with RS Components. As...
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German government agree on increased scope for Intel wafer fabrication site in MagdeburgIntel and the German federal government have signed a revised letter of intent for...
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Vitesco Technologies and ROHM have signed a long-term SiC supply partnershipVitesco Technologies has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through...
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IAR and Heroic Faith Medical to enhance data security for the healthcareIAR joins forces with Heroic Faith Medical to enhance data security in the healthcare...
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Intel plans assembly and test facility in PolandIntel announced that it has selected an area near Wrocław, Poland, as the site...
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Powercast and Powermat partnershipTwo of the world’s pioneers of wireless power technology, Powercast with its long-range over-the-air...
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Intel Launches Agilex 7 FPGAs with R-TileIntel‘s Programmable Solutions Group launched the Intel Agilex 7 with the R-Tile chiplet. It...
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Inova Semiconductors achieves a hat-trick: F.A.Z.-Institut honours the company as an innovation leader in Germany for the third year in a rowThe F.A.Z.-Institut – a subsidiary of the Frankfurter Allgemeine Zeitung – ranks Inova Semiconductors...
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Renesas expands focus on India with new NB-IoT solutionRenesas Electronics introduced an NB-IoT (Narrowband Internet of Things) chipset specifically for the Indian...
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Danisense to exhibit at PCIM 2023Danisense will be exhibiting at PCIM 2023 in Nuremberg from 9th to 11th May...
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Infineon enables innovative solution for second life of electric passenger car batteriesSTABL Energy uses MOSFETs from Infineon Technologies to make stationary energy storage systems from...
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KYOCERA AVX launches new solderless WTB card-edge connectorsKYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
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Renesas completes acquisition of TransphormRenesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
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Linxens and Nocturnal join forces to accelerate the development of innovative medical devicesLinxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
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Advantech launches ITA-168/178 seriesAdvantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROEMIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
