NewsMarket / Trends
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Infineon supplies SiC power modules to Xiaomi EVInfineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC and...
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Siemens collaborates with TSMC on design tool certificationsAt the TSMC 2024 North America Technology Symposium, Siemens Digital Industries Software announced that...
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Infineon and ETAS collaborate to optimize security of next-generation AURIX MCUInfineon Technologies has integrated the ESCRYPT CycurHSM 3.x Automotive Security Software Stack into the...
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KDPOF collaborates with Hinge TechnologyKDPOF announced their strategic partnership with Hinge Technology to solve key technical issues in...
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Intel welcomes Open Platform for enterprise AIThe Linux Foundation AI & Data announced the Open Platform for Enterprise AI (OPEA)...
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Infineon provides FOXESS with power semiconductorsInfineon Technologies supplies its power semiconductor devices to FOXESS, a fast-growing company in the...
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Anglia Live expands footprint into EuropeAnglia Components PLC recently announced it is bringing the Anglia Live eCommerce platform to...
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Renesas expand its power semiconductor production capacityRenesas Electronics announced that it has started operations at its Kofu Factory, located in...
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VIA optronics and Antolin unveil SunriseVIA optronics and Grupo Antolin–Irausa, a global provider of automotive technology solutions, recently unveiled...
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Advantest and Toray Engineering establish technical partnershipAdvantest Corporation announced that it has entered into a technical partnership with Toray Engineering...
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Infineon and Amkor deepen partnershipInfineon Technologies is strengthening its outsourced backend manufacturing footprint in Europe and announced a...
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Nordic Semiconductor showcases Thingy:91 XAt embedded world Nordic Semiconductor will share a preview of its breakthrough “Thingy:91 X”,...
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Green Hills Software delivers new solutions for NXP’s Open S32 CoreRide platformGreen Hills Software announced its significant role in NXP Semiconductors’ open S32 CoreRide platform,...
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SECO and NXP collaborate to bring Clea to industrial and IoT applicationsSECO announced it is working with NXP Semiconductors to bring SECO’s Clea software solution...
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Infineon presents innovative solutions for a greener future at embedded world 2024At embedded world 2024, Infineon Technologies will demonstrate how its innovative semiconductor solutions support...
News/Analysis read all ▶
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KYOCERA AVX launches new solderless WTB card-edge connectorsKYOCERA AVX launched the new 9169-000 Series single-piece wire-to-board card-edge connectors. The new 9169-000...
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Renesas completes acquisition of TransphormRenesas Electronics Corporation announced that it has completed the acquisition of Transphorm. With the...
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Linxens and Nocturnal join forces to accelerate the development of innovative medical devicesLinxens, global expert in the design and manufacture of electronic components, and Nocturnal, specialized...
Products read all ▶
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Advantech launches ITA-168/178 seriesAdvantech launches its latest compact and fanless edge computers—the ITA-168 and 178 series. These...
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Solid Sands launches SuperGuard Amsterdam version 1.2Solid Sands has launched an updated version of its SuperGuard product, the world’s first...
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A new add-on board for global tracking and telematics from MIKROEMIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global...
