CUI: new line of Peltier module

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CUI announced a new line of high performance Peltier modules based on arcTEC structure that combines thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot.

The CP20H, CP30H, CP39H, CP60H, and CP85H series all employ the arcTEC structure and range in size from 15 mm to 40 mm, with profiles as low as 3.1 mm. These thermoelectric modules are available with a ∆Tmax of 77°C (Th=50°C) and current ratings ranging from 2.0 A to 8.5 A.

Thanks to their solid state construction, temperature control, and quiet operation, these thermoelectric coolers are ideally suited to high density, high power medical and industrial applications as well as refrigeration and sealed environments where forced air cooling is not an option.

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