The CEA (Atomic Energy Commission) and Intel have recently signed a new R&D agreement in Paris that expands collaboration between the two organisations.
The CEA-Intel agreement involves several strategic research programmes with the teams of the CEA’s Leti Institute in Grenoble, including the Internet of Things, high-speed wireless communication, security technologies and 3D displays. It also means that the two companies will work together to jointly submit projects to Europe’s biggest innovation and research programme, Horizon 2020.
This agreement, concluded for a minimum of five years, concerns the current development of digital technologies and the Internet of Things, including the development of new materials in order to further the miniaturisation and adaptability of electronic components used in mobile phones. The nature of these components and their layout are crucially important to the system’s performance, size and cost. Furthermore, it concerns the development of wireless communication systems and faster exchanges, and the integration of connected objects and the study of low-consumption communication technologies.
Marie-Noelle Semeria, the director of the CEA Leti Institute, said, “The CEA and Intel have a long history of shared technological development in high-performance computing. This collaboration marks the recognition of the CEA-Leti as one of Europe’s most innovative players in the IoT and the basic technologies of Cloud computing and Big Data. It also increases the attractiveness of the Grenoble Valley in terms of microelectronics.”
In the picture: Daniel Verwaerde (CEA), Raj Hazra (Intel) e Marie-Noelle Séméria (CEA-Leti) credit: L.Godart/CEA