New flip-chip die bonder from ITEC

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ITEC introduces the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.

The ADAT3 XF TwinRevolve is designed with precision in mind with an accuracy better than 5 μm @ 1σ. This level of precision, combined with its ultra-high throughput, opens possibilities for a whole new generation of products where flip-chip assembly was previously too slow and too expensive. The use of flip-chip packages can also contribute to more reliable products with lower power consumption and better high-frequency and thermal management performance compared to traditional wire bonds.

Instead of the traditional forwards and backwards up/down linear motion, the new die bonder employs two rotating heads (‘TwinRevolve’) to pick, flip and place the die in a fast, smooth action. This unique mechanism reduces inertia and vibration, allowing for the same accuracy at much higher speeds. This development opens up new opportunities for chipmakers to transition their high-volume wire-bonded products to flip-chip technologies.

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