Intel plans assembly and test facility in Poland

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Intel announced that it has selected an area near Wrocław, Poland, as the site of a new cutting-edge semiconductor assembly and test facility. This facility will help meet critical demand for assembly and test capacity that Intel anticipates by 2027. Intel expects to invest up to $4.6 billion in the facility, which will have the capacity to expand. When completed, the facility will support approximately 2,000 Intel employees. The construction of the facility is also expected to create several thousand more jobs, in addition to eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval.

Intel’s planned investment in Poland, combined with its existing wafer fabrication facility in Leixlip, Ireland, and its planned wafer fabrication facility in Magdeburg, Germany, will help create a first-of-its-kind end-to-end leading-edge semiconductor manufacturing value chain in Europe. It will also serve as a catalyst for additional ecosystem investments and innovation in Poland and across the European Union.

“Poland is already home to Intel operations and is well positioned to work with Intel sites in Germany and Ireland. It is also very cost-competitive with other manufacturing locations globally and offers a great talent base that we are excited to help to grow,” said Intel CEO Pat Gelsinger. “We’re grateful for the support from Poland as we work to grow the local semiconductor ecosystem and contribute to the EU’s goal of creating a more resilient and sustainable semiconductor supply chain.”

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