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EMBEDEDD 64
ADVANTECH TECHNOLOGY...................................................I COPERTINA
CONTRADATA ..........................................................................31
DIGI-KEY ELECTRONICS.........................................................II COPERTINA
EUROLINK SYSTEMS ..............................................................39
EUROTECH ...............................................................................3
GOMA ELETTRONICA..............................................................7
KEVIN SCHURTER ...................................................................21
MC TRONIC ...............................................................................47
MICROCHIP TECHNOLOGY.....................................................4
MOUSER ELECTRONICS.........................................................37
SISTEMI ELETTRONICI AVANZATI.........................................71
UNIVERSAL ROBOTS ..............................................................III COPERTINA
SI PARLA DI...
SOCIETÀ PAG.
INSERZIONISTI
ABACOM .....................................................................................................................................36
ABB.............................................................................................................................................32
ADVANTECH EUROPE..............................................................................................................8-82
ALLEGRO MICROSYSTEMS........................................................................................................78
ANDERSDX .................................................................................................................................80
ARROW ELECTRONICS ..............................................................................................................75
AVX.............................................................................................................................................56
BEHLMAN ELECTRONICS...........................................................................................................56
B-PLUS .......................................................................................................................................48
CONCURRENT TECHNOLOGIES..................................................................................................56
CONGATEC.............................................................................................................................12-75
CUI..............................................................................................................................................76
CURTISS-WRIGHT CONTROLS DEFENSE .................................................................................48
CYPRESS SEMICONDUCTOR .....................................................................................................76
DAWN VME PRODUCTS .............................................................................................................56
DISTEC........................................................................................................................................44
ECLIPSE FOUNDATION ...............................................................................................................52
ECLIPSE IOT ...............................................................................................................................52
ECW EELY...................................................................................................................................32
ELMA ELECTRONIC MACHINING................................................................................................56
ENAC...........................................................................................................................................28
ERICSSON POWER MODULES ...................................................................................................13
ESAOTE.......................................................................................................................................22
FEDERAL AVIATION ADMINISTRATION .....................................................................................28
FLIR SYSTEMS ...........................................................................................................................74
GE GENERAL ELECTRIC .............................................................................................................28
GRAND VIEW RESEARCH...........................................................................................................22
GREEN HILLS SOFTWARE............................................................................................... 26-64-81
HITACHI DISPLAY.......................................................................................................................32
IDTECHEX ...................................................................................................................................32
INTERSIL CORPORATION...........................................................................................................81
KASPERSKY LAB........................................................................................................................18
KOE EUROPE ..............................................................................................................................74
KONTRON ...................................................................................................................................78
KYOCERA DISPLAY AMERICA....................................................................................................32
LAUTERBACH .............................................................................................................................36
LEMONBEAT ...............................................................................................................................18
LETI ............................................................................................................................................14
LG ELECTRONICS.......................................................................................................................32
LYNX SOFTWARE TECHNOLOGIES.............................................................................................70
MAXIM INTEGRATED..................................................................................................................16
MOLEX........................................................................................................................................56
MONTAVISTA ..............................................................................................................................20
MURATA ELETTRONICA..............................................................................................................76
NIPPON SHEET GLASS...............................................................................................................32
NISSHA PRINTING......................................................................................................................32
ON SEMICONDUCTOR................................................................................................................80
ONEM2M ....................................................................................................................................52
OPENMDM ECLIPSE WORKING GROUP ....................................................................................60
PEAK SOLUTIONS ......................................................................................................................60
PENTAIR TECHNICAL SOLUTIONS .............................................................................................56
PERFECTRON..............................................................................................................................48
PHOENIX CONTACT ....................................................................................................................77
PLS .............................................................................................................................................36
PORTWELL .................................................................................................................................75
PROJECT MANGOH ....................................................................................................................52
RED HAT .....................................................................................................................................52
RS COMPONENTS ......................................................................................................................15
SAMTEC ITALY............................................................................................................................56
SEGGER MICROCONTROLLER SYSTEMS.............................................................................36-82
SEIKO EPSON .............................................................................................................................32
SHUTTLE COMPUTER ................................................................................................................80
SILICON MOTION TECHNOLOGY................................................................................................16
SWISSBIT ...................................................................................................................................77
SYMANTEC .................................................................................................................................70
SYNOLOGY .................................................................................................................................78
TE CONNECTIVITY......................................................................................................................56
TITAN AEROSPACE.....................................................................................................................28
TRULY SEMICONDUCTORS........................................................................................................32
ULIS............................................................................................................................................77
UNIONE EUROPEA......................................................................................................................14
VECTORCAST..............................................................................................................................68
VERSALOGIC ..............................................................................................................................48
VIA TECHNOLOGIES ...................................................................................................................81
VIPA ITALIA ................................................................................................................................32
XILINX ........................................................................................................................................40
XJTAG .........................................................................................................................................74
YOUNGFAST ...............................................................................................................................32
EMBEDDED 64 • MAGGIO • 2017
6
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