Tag per "iot-en-2"
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Sondrel’s SFA 100 IP platform for intelligence gathering chips at the EdgeDesigned to be the solution for an AI compute device right at the Edge,...
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Internet of Things modules for a smarter worldArrow Electronics, Panasonic Industry, and STMicroelectronics (ST) have introduced a low-power wireless multi-sensor edge-intelligence...
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SensiSUB lowers barriers for IoT application developmentSensiEDGE have announced a new SensiSUB system-on-module (SoM) starter kit. The SensiSUB IoT SoM...
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Lemonbeat Studio 2.0 accelerate the development of IoTLemonbeat GmbH is presenting Lemonbeat Studio 2.0, its latest software for the rapid development...
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New Silicon Labs Wi-Fi devices for the IoTSilicon Labs has introduced a new Wi-Fi portfolio to simplify the design of power-sensitive,...
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Cypress: wireless combo solution for IoT applicationsCypress Semiconductor announced a new wireless solution that combines 802.11ac Wi-Fi, Bluetooth and Bluetooth...
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IAR Systems and Ayla Networks: partnership for IoT product developmentIAR Systems announces a partnership with Ayla Networks, a provider of a IoT platform,...
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Samtec: wireless sensor module for IoT and wearableSamtec announced the release of the first Samtec nMode Wireless Sensor Module. nMode Wireless...
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Intel starts sampling of Stratix® 10, the industry’s first 14nm FPGAIntel has started sampling to customers Stratix® 10 field programmable arrays, the industry’s first...
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Silicon Labs Acquires Micrium, a leading RTOS CompanySilicon Labs announced the acquisition of Micrium, a leading supplier of real-time operating system...
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Intel acquires Italy’s YogitechIntel has acquired Yogitech, an Italian company focused on functional safety for semiconductors. The...
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Dialog Semiconductor introduces 12 DoF Bluetooth Smart Sensor Development Platform
Dialog Semiconductor plc today announced the world’s lowest power and smallest 12 DoF (Degrees-of-Freedom)...
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Internet of Things market to nearly double by 2019
Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of...
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System-in-Package industry will reach more than $19B by 2026System-in-Package Technology and Market Trends 2021 report from Yole Développement (Yole) say that the...
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Infineon and IDEX Biometrics announce a platform for biometric smart cardsInfineon Technologies and IDEX Biometrics announced a reference design for the next generation biometric...
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Dialog Semiconductor extends partnership with SiFiveDialog Semiconductor announced that it has extended its partnership with SiFive. Dialog is SiFive’s...
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New PXI multi-cell battery simulator modules from Pickering InterfacesPickering Interfaces launched a new family of battery simulator modules for Electric Vehicle (EV)...
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TDK-Lambda: compact 120W and 240W three-phase input DIN rail power suppliesTDK Corporation announces the addition of three-phase AC input models to the TDK-Lambda DRB...
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Smart HV-eFuse for electromobility from Rutronik’s ABU and VishayThe cooperation between the e-mobility specialists of Rutronik‘s Automotive Business Unit (ABU) and Vishay‘s...
