Last year, Sondrel launched its Architecting the Future series covering the SFA 100 to the SFA 350A. These pre-packaged, SoC IP architectures provide a fast track for designing a new chip as all that is needed is to select the most suitable foundry and process, third party IP and to integrate any of the customer’s own IP to create a custom solution. They also reduce the risk by being off-the-shelf.
Sondrel’s supply chain manufacturing service has further reduced risk and TTM (Time To Market) as it has created a series of pre-packaged supply chains specifically tailored for each of its Architecting the Future platforms.
Ian Walsh, Sondrel’s VP ASIC Business Development, explained; “Customers need to know the overall budget and time-to-market as key decision points in deciding whether to green light a new chip project or not. The process of turning a chip design into final silicon has many variables such as chip size, which foundry and process node to use, what testing regime to adopt, how to package the device, etc. As our range of SoC architectures gives five starting points, we have been able to reduce all these variables into a small matrix for each. This means we have the relevant data at our fingertips with predefined and costed production routes rather than having to start from scratch every time. In other words, we have used our design and supply chain manufacturing services to create off-the-shelf, costing models that complement each of our Architecting the Future platforms.
“A new chip is a major decision for any company and it is thus vital to mitigate risks. We reduce risks with our pre-packaged SFA designs and now reduce risks further with our pre-packaged supply chain routes for each. Unknowns are virtually removed giving a clearly defined and well-trodden path from design to shipping silicon making us the partner of choice to deliver on time and on budget.”