The PICMG consortium announces that COM-HPC has entered member review. The member review phase occurs after the technical subcommittee approves the specification and acts as a final review by all PICMG members in good standing. Reaching this approval step is a milestone in ensuring ratification will be reached in early 2021.
The base specification will complement a Platform Management Interface Specification, COM-HPC EEEP, and Carrier Board Design Guide.
In conjunction with the review cycle, PICMG has published a preview specification. The abridged specification is available for public download and distribution.
COM-HPC defines five module sizes to deliver edge server performance for small, rugged data centers. The new specification will complement COM Express, which will continue to play a crucial role in the COM marketplace for many years.
PICMG developed this specification to address emerging requirements in the embedded and edge computing market.