KIOXIA Introduces Industrial Grade BiCS FLASH 3D Flash Memory

Posted 30 August 2022

KIOXIA Europe announced that it is sampling new industrial-grade flash memory devices. This new lineup utilizes KIOXIA’s latest generation BiCS FLASH 3D flash memory with 3-bit-per-cell (triple-level cell, TLC) technology, and is available in a 132-BGA package. Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the unique requirements of industrial applications – including telecommunication, networking, embedded computing and much more.

The new KIOXIA devices support a wide temperature range (-40°C to +85°C) and have the ability to convert Triple-Level Cell (TLC) flash memory (3-bits per cell) to Single-Level Cell (1-bit per cell) mode – improving performance and reliability.

“KIOXIA is committed to supporting multiple industrial-grade solutions and accommodating applications that have long life cycles. With the addition of next-generation Industrial Grade BiCS FLASH 3D flash memory, we can now present an efficient and highly reliable embedded memory solution for environments requiring a wider temperature range and increased support for the processor,” said Axel Stoermann, KIOXIA Europe.



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