Infineon launches new OptiMOS packages in TOLx family

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Infineon Technologies offers more choices to power system designers to meet diverse design needs and achieve maximum performance in the smallest space. With the innovative TO-Leadless (TOLL) package, Infineon now offers two new OptiMOS power MOSFET packages in the TOLx family: TOLG (TO-Leaded with Gullwing leads) and TOLT (TO-Leaded Top-side cooling). Together, the TOLx family offers very low RDS(on) and a high-current rating over 300 A to increase system efficiency in high-power density designs.

The TOLG package combines the best features of TOLL and D 2PAK 7-pin packages, sharing the same 10 x 11 mm 2 footprint and electrical performances as TOLL with added flexibility comparable to D 2PAK 7-pin. The main advantages of TOLG are particularly apparent in designs with aluminum-insulated metal substrate (Al-IMS) boards.

The TOLT package is optimized for superior thermal performance. Constructed with its lead-frame flipped to position exposed metal on the top side, the package contains multiple gullwing leads on each side for high current carrying drain and source connections. With a flipped lead-frame, heat passes from the exposed metal top side, through the insulating material, directly to the heatsink. Compared to the TOLL bottom-side cooling package, the TOLT improves R thJA, by 20 percent and R thJC by 50 percent. These specifications enable a lower bill of material cost, particularly for the heatsink.

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