Infineon AIROC CYW20829 SoC ready with latest Bluetooth 5.4 specification

Posted 24 March 2023

Infineon Technologies announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation, and automotive.

Infineon’s AIROC CYW20829 device has an integrated power amplifier providing 10 dBm of transmit output power and receive sensitivity of -98 dBm for LE 1Mbps and -106 dBm for LE Long Range 125 Kbps. CYW20829 is a dual-core Arm M33 device where one M33 core is reserved as the Bluetooth controller, and the second Arm Cortex-M33 is available for customer applications. The CPU subsystem provides 256 K RAM, XIP interface for external flash, and a set of peripherals including CAN to enable a diverse set of applications. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys and cryptography acceleration.

The recently released Bluetooth Core Specification 5.4 adds several significant capabilities to the existing specification, including PAwR (Periodic Advertising with Response), Encrypted Advertisement Data (EAD) and LE GATT Security Levels Characteristic.



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