The new System-in-Package (SiP) MSMP1 from ARIES Embedded is based on the STM32MP1 CPU family from ST Microelectronics with powerful single or dual Arm CortexA7 cores (up to 800 MHz), combined with a CortexM4 core (up to 209 MHz).
The SiP is compliant with SGET’s OSM (Open Standard Module) standard.
The MSMP1 modules are scalable in terms of performance and memory expansion and can therefore be individually adapted to many project requirements. The system-in-packages support 512 MB to 4 GB DDR3L RAM and 4 to 64 GB eMMC NAND Flash. The numerous interfaces include 10/100/1000 Mbit Ethernet, USB2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC/DAC, as well as a parallel display interface and camera input. The modules are available in the commercial temperature range, with 0 °C to +70 °C, as well as in the industrial temperature range, with -40 °C to +85 °C.
Samples of the MSMP1 SiP will be available from the third quarter of 2022. ARIES Embedded will start series production in the fourth quarter of 2022.