Dialog Semiconductor introduces 12 DoF Bluetooth Smart Sensor Development Platform

Posted 16 March 2016

Dialog Semiconductor plc today announced the world’s lowest power and smallest 12 DoF (Degrees-of-Freedom) wireless smart sensor development kit for IoT applications. Dialog’s DA14583 SmartBond™ Bluetooth Smart SoC is combined with Bosch Sensortec’s gyroscope, accelerometer, magnetometer, and environmental sensors on a tiny 16mm x 15mm printed circuit board. The board is supplied as a dongle in a plastic housing. Typical current consumption is only 1.3mA when streaming sensor data, less than 110µA in advertising mode and under 11µA in power-save mode.

The new development platform accelerates time-to-market for environmental and motion sensing modules used in wearables, virtual reality, 3D indoor mapping, navigation, remote controls and many other IoT sensor-based applications. It can stream raw sensor data as well as output the absolute real world orientation of a device in quaternion form.

The complementary software development kit (SDK) includes SmartFusion, Dialog’s smart sensor library for data acquisition, auto-calibration, and sensor data fusion and runs on the DA14583’s embedded Cortex M0® processor. Dialog’s sensor development kit can also be used for 9 DOF application developments.

The DA14583 has an ARM® Cortex®-M0 baseband processor integrated with an ultra-low power Bluetooth Smart radio. It can be used as a standalone application processor or as a data pump in hosted systems and has a flexible memory architecture, including 1 Mbit of Flash memory, for storing Bluetooth profiles and custom application code.
Dialog’s 12 DOF wireless smart sensor development kits are available now at Digi-Key and Mouser.


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