Components-en
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u-blox announces low-power multi-GNSS module with built-in antennau-blox has announced the u-blox SAM-M10Q antenna module, offering a best-in-class low-power positioning solution....
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Agile Analog announces RC Oscillator IPAgile Analog has announced the availability of its new RC Oscillator IP. This is...
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Nexperia releases new MOSFETs in DFN0603 packageNexperia announced the release of a new range of 20 V & 30 V...
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New S32G3-based miriac System-on-Module from MicroSys ElectronicsMicroSys Electronics announced support for the new NXP Semiconductors S32G3 vehicle network processor, thereby...
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CUI Devices adds new circular cable assemblies product lineCUI Devices‘ Interconnect Group announced the introduction of circular cable assemblies to its cable...
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KEMET introduces 1,000 V AC/DC AEC-Q200 common mode choke solutionKEMET announces its new SCF-XV series of AEC-Q200 qualified common mode chokes. This series...
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PROVERTHA expands D-Sub portfolio with customer-specific solutionsProvertha expands its comprehensive D-Sub connector range by offering customised products and special solutions...
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Infineon adds the AIROC CYW20820 Bluetooth & Bluetooth LE system on chipInfineon Technologies is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system...
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USB Type-C PD3.0 sink controllers from Diodes IncorporatedDiodes Incorporated announced two new high-performance USB PD3.0 sink controller ICs . The DIODES...
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Winbond TrustME W77Q Secure Flash obtains SESIP Level 2 certificationWinbond Electronics announced that the company’s TrustME W77Q Secure Flash had obtained Security Evaluation...
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u-blox releases full-featured platform to test and validate IoT solutionsu-blox has announced the u-blox XPLR-IOT-1 IoT explorer kit, an all-in-one package to test,...
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Socionext announces shipment of the world’s first HD-PLC LSI compliant with IEEE 1901-2020Socionext announced sample shipments of the SC1320A HD-PLC communication LSI starting in June 2022...
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Infineon introduces new high-performance XENSIV MEMS microphonesInfineon Technologies is launching its next-generation XENSIV MEMS microphones. The models IM69D127, IM73A135 and...
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Tunable mux/demux linear redrivers from DiodesDiodes Incorporated has introduced two new multiplexer/demultiplexer (Mux/DeMux) linear ReDrivers, supporting the 20Gbps DisplayPort...
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IP67 rated models added to CUI Devices’ tactile switches lineCUI Devices’ Switches Group announced the addition of IP67 rated models to its line...
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Infineon cooperate with Fingerprints Cards for biometric payment cardsInfineon Technologies and Fingerprint Cards announced the signing of a joint development and commercialization...
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Bel appoints Global ESG DirectorBel Fuse announced the appointment of Ping Gencianeo as its new Global ESG Director....
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Infineon Austria cooperates with University of ZagrebInfineon Austria and the Faculty of Electrical Engineering and Computing (FER) at the University...
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TDK-Lambda: six new output configurations for the 7.5kW GENESYS+ seriesTDK Corporation announces the introduction of six new models to the 7.5kW TDK-Lambda GENESYS+...
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Keysight delivers new solar array simulator solution for satellite power systemsKeysight Technologies announced the new MP4300A Series Modular Solar Array Simulator (SAS) to emulate...
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duagon: 5G wireless high-speed interface board for rail applicationsDesigned for communication in embedded and harsh environments like rail, the new G239 is...
