Components-en
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Infineon expands Prime Switch familyInfineon expands the high-power Prime Switch family with the new Press Pack IGBT (PPI)...
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u-blox announces a tri-radio moduleu-blox has announced the u-blox MAYA-W2 tri-radio module. Supporting Wi-Fi 6, Bluetooth low energy...
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High efficiency low voltage 3A buck converter from Diodes IncorporatedDiodes Incorporated has introduced the automotive-compliant DIODES AP61300Q synchronous buck converters. These 3A-rated devices...
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M12 adapter from PROVERTHA with X to D and D to X codingProvertha has developed a robust and extremely compact M12 adapter solution that allows a...
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Nexperia widens its offering of discrete components in DFN packaging with side-wettable flanksNexperia announced its latest product additions to a growing range of discrete devices which...
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Antenova’s new small dual-band antenna for IoTAntenova launches a new low-profile antenna for Europe’s 868 MHz bands and the US...
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VIAVI releases ALT-9000 radio altimeter test solutionVIAVI Solutions announced the launch of the ALT-9000 universal radio altimeter (RADALT) flight line...
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Space-saving Schottky rectifiers from Diodes IncorporatedDiodes Incorporated has announced the introduction of a series of high-current Schottky rectifiers in...
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Magnachip introduces a new 40V MOSFET for BLDC motorsMagnachip Semiconductor announced that the company has released a new 40V Metal-Oxide-Semiconductor Field-Effect Transistor...
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Winbond and Infineon extend collaboration with double bandwidth HyperRAM 3.0Winbond Electronics with Infineon Technologies have announced the expansion of their HYPERRAM product collaboration...
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VPC hybrid capacitors from VINATech replace batteriesVINATech has announced that its VPC (Vina Pulse Capacitor) hybrid capacitors are being used...
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Infineon extends CoolSiC M1H technology portfolioInfineon Technologies introduces a new CoolSiC technology: the CoolSiC MOSFET 1200 V M1H. The...
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A new generation of 3D touchless user interfacesTouchNetix announces fully integrated aXiom touchscreen chips which offer new 3D sensing capabilities by...
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Panasonic Industry’s new Solid Polymer capacitorsPanasonic Industry‘s SP-Cap (Solid Polymer ) portfolio of Aluminum Polymer capacitors is an interesting...
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The Capacitive Hidden Switch from Schurter now at RutronikThe Capacitive Hidden Switch (CHS) from Schurter, available at Rutronik, functions entirely without mounting...
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POLYN Technology and Fraunhofer Mikroelektronik join forces for technological optimizationPOLYN Technology and Fraunhofer Mikroelektronik will develop a special process optimization as a part...
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IC Insights: O-S-D bulletinWorldwide sales of optoelectronics, sensors and actuators, and discrete semiconductors (O-S-D) each climbed to...
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AMD completes acquisition of XilinxAMD announced that it has completed the acquisition of Xilinx, creating the high-performance and...
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Battery-powered AI/ML-based acoustic event detection and sensor fusion alarm system from InfineonInfineon Technologies is introducing its battery-powered Smart Alarm System (SAS). The technology platform achieves...
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TDK-Lambda: 40W and 60W DC-DC convertersTDK Corporation announces the introduction of the TDK-Lambda brand PXD40 and PXD60 series of...
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Infineon’s AIROC Wi-Fi/Bluetooth solutions now available with NVIDIA Jetson Edge AI platformInfineon Technologies announced that it is bringing its AIROC Wi-Fi and Bluetooth connectivity solutions...
